Offered Every Fall

Credit Hours: 3-0-3
Prerequisites: Graduate standing in engineering or a related discipline.
Catalog Description: Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package. Crosslisted with ECE and MSE 6776.
Textbooks: Rao Tummala, Fundamentals of Microsystems Packaging, 1st Edition, McGraw Hill, 2001.
Instructors: Rao Tummala (ECE - Fall 2004)