Offered Every Fall
| Credit Hours: | 3-0-3 | |
| Prerequisites: | Graduate standing in engineering or a related discipline. | |
| Catalog Description: | Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package. Crosslisted with ECE and MSE 6776. | |
| Textbooks: | Rao Tummala, Fundamentals of Microsystems Packaging, 1st Edition, McGraw Hill, 2001. | |
| Instructors: | Rao Tummala (ECE - Fall 2004) | |