CASPaR Lab


Education

  • Ph.D., The Ohio State University, 1989
  • M.A.Sc., University of Ottawa, 1985
  • B.Eng., University of Madras, 1982

Teaching Interests

Professor Sitaraman's teaching interests include core mechanical engineering courses at undergraduate and graduate levels, emphasizing computational modeling, fabrication processes, and failure and reliability analyses. He integrates principles of computer-aided design and computer-aided engineering to develop students' technical expertise. His teaching approach encourages hands-on learning and multidisciplinary problem-solving, fostering student engagement across mechanical engineering fundamentals and advanced manufacturing technologies.

Research Interests

Prof. Sitaraman's research program aims to be at the cutting edge of microsystems used in various applications and is developing innovative experimental techniques and computational models to study and advance next-generation microsystems with a particular emphasis on the design, fabrication, characterization, modeling, and reliability of micro-scale and nano-scale structures used in rigid and flexible microsystems.

Recent Publications

  • YongWon Lee, Kaushik Godbole, Hyunggyu Park, Kyoung‐sik Moon, Muhannad S. Bakir et al., Board-Level Reliability of 100 mm × 100 mm Large Glass Packages: Warpage and Thermo-Mechanical Reliability for AI/HPC Applications, IEEE Transactions on Components Packaging and Manufacturing Technology, 2025. DOI: 10.1109/tcpmt.2025.3614186.
  • Yi Zhou, Kexin Hu, Manos M. Tentzeris, Suresh K. Sitaraman, Multiphysics Testing and Numerical Modeling of Fully 3-D/Inkjet-Printed Microstrip Line Under 12500 Cycles of Bending for 5G/mm-Wave Flexible Hybrid Electronics Packaging, IEEE Journal on Flexible Electronics, 2025. DOI: 10.1109/jflex.2025.3585058.
  • Kaushik Godbole, Rui Chen, Suresh K. Sitaraman, Electrical Reliability of Conductor Printed on Stretchable Substrate Under Biaxial Fatigue Loading, IEEE Journal on Flexible Electronics, 2025. DOI: 10.1109/jflex.2025.3620764.
  • Rambhatla, VNN Trilochan, and Suresh K. Sitaraman. "Crowbar Loading-A New Test Technique to Characterize Interfacial Delamination." Engineering Fracture Mechanics 282 (2023): 109144.
  • Ginga, Nicholas J., and Suresh K. Sitaraman. "Thermomechanical reliability investigation of carbon nanotube off-chip interconnects for electronic packages." IEEE Transactions on Components, Packaging and Manufacturing Technology 12, no. 8 (2022): 1282-1292.