Title: Thermal Management of 3-D Stacked Chips Using Thermoelectric Coolers and Microfluidic Devices When: Wednesday, June 19, 2013 at 10:00 AM Where: Love Building, Room 109
Title: Thermal Management of 3-D Stacked Chips Using Thermoelectric Coolers and Microfluidic Devices When: Wednesday, June 19, 2013 at 10:00 AM Where: Love Building, Room 109
Title: Development of a Dynamic Costing Model for Assessing Downtime and Unused Capacity Costs in Manufacturing When: Wednesday, June 19, 2013 at 1:30 PM Where: MARC Building, Room 201