Title: Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices: Using Laser Ultrasound and Finite Element Method When: Tuesday, July 15, 2008 at 3:00 PM Where: MARC Building, Room 331
Blank Space (small)
(text and background only visible when logged in)
(text and background only visible when logged in)
Responding to COVID-19
The Georgia Tech community has joined in the battle against Covid-19, contributing our expertise, innovation, and indomitable spirit to the effort. We aim to keep you informed as our efforts evolve and our reach expands.