Title: A Hierarchical Framework for the Multiscale Modeling of Microstructure Evolution in Heterogeneous Materials When: Wednesday, October 3, 2007 at 10:30 AM Where: Love Building, Room 210

Title: Study of SnAgCu Alloy Reliability through Material Microstructure Evolution and Laser Moire Interferometry When: Wednesday, November 7, 2007 at 1:30 PM Where: MARC Building, Room 201

Title: Design and Fabrication of Free-Standing Structures as Off-Chip Interconnects for Microsystems Packaging When: Thursday, November 15, 2007 at 3:15 PM Where: MARC Building, Room 431

Title: Experimentally Validated Multiscale Thermal Modeling of Electronic Cabinets When: Friday, November 16, 2007 at 3:00 PM Where: Love Building, Room 109

Title: Using Parameterized Efficient Sets to Model Alternatives for Systems Design Decisions When: Tuesday, December 4, 2007 at 10:00 AM Where: MARC Building, Room 114

Title: A Control Approach to The Protein-Folding Problem When: Tuesday, December 4, 2007 at 12:30 PM Where: Love Building, Room 311

Title: Influence of Microstructure in Rolling Contact Fatigue of Bearing Steels with Inclusions When: Wednesday, December 19, 2007 at 1/1/1900 Where: Love Building, Room 210

Title: Regulation of Cell Adhesion Strengthening Through Nanoscale Organization of Focal Adhesions and Integrin Clustering When: Thursday, December 20, 2007 at 10:00 AM Where: U.A. Whitaker, Room 1103

Title: Rapid Prototyping of Microsystems Packaging by Data-Driven Chip-First Approach using Nano-particle Silver Interconnects When: Tuesday, January 22, 2008 at 10:15 AM Where: MARC Building, Room 431

Title: Quality Inspection and Reliability Study of Solder Bumps in Packaged Electronic Devices: Using Laser Ultrasound and Finite Element Methods When: Thursday, January 24, 2008 at 9:30 AM Where: MARC Building, Room 401