Education

  • Ph.D., Indian Institute of Science, Bangalore, 1995
  • M.E., Madras Institute of Technology, India, 1990
  • B. Tech., Nagarjuna University, India, 1988

Research Areas

Research

Integrated Analytical and Computational Tools (IntACT) for Composites with Nanofillers

Advanced composite materials with nanofillers are increasingly replacing the metal counterparts in many applications. Manufacturing and application of nanocomposites need upfront computational tools for detail application specific analysis and characterization. Dr. Pucha’s current research efforts are focused on developing integrated analysis and computational tools of manufacturing and application of nanocomposites. These integrated tools systematically consider and quantify many manufacturing parameters in modeling 3D network of nanofillers in a RVE of matrix. The developed continuum models can be used for mechanical and electrical characterization of nanocomposites for various applications. The automated tools with user interface can provide quick what-if analysis and characterization data for manufacturing nanocomposites with application specific properties.

  • CETL Undergraduate Educator Award 2012
  • Inaugural 1969 Teaching Scholar, 2008 – 2009, CETL, Georgia Tech
  • SciTrain U Scholar – Fall 2010
  • Senior Member - American Institute of Aeronautics and Astronautics (AIAA)
  • Senior Member - Institute of Electrical and Electronics Engineers (IEEE)

Representative Publications

  • Bhuiyan, M.A., Pucha, R.V., Karevan, M., Kalaitzidou, K.,” Tensile Modulus of Carbon Nanotube / Polypropylene Composites - A Computational Study Based on Experimental Characterization”, Computational Materials Science, Vol. 50(8), 2011, pp. 2347 – 2353.
  • Karevan, M., Pucha, R.V., Bhuiyan, M.A., Kalaitzidou, K., “Effect of Interphase Modulus and Naofiller Agglomeration on the Tensile Modulus of Graphite Nanoplatelets and Carbon Nanotube Reinforced Polypropylene Nanocomposites”, Carbon Letters, Vol. 11(4), 2010, pp. 325-331.
  • Pucha, R.V., Qu, J., and Sitaraman, S.K., 2008, “Mixed-Signal Package Reliability” in “Introduction to System-on-Package (SOP),” [Book Chapter] Editors, Tummala, R.R., and Swaminathan, M., Published by McGraw-Hill, NY,  pp. 443-487.
  • Kumbhat, N., Raj, P.M., Pucha, R.V., Tsai, J., Atmur, S., Bongio, E., Sitaraman, S.K. and Tummala, R., 2007, “Novel Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging,” IEEE Transactions on Advanced Packaging, Vol.30 (4), pp 641-653.
  • Pucha, R.V., Ramakrishna, G., Mahalingam, S. and Sitaraman, S.K., 2004, “Modeling Spatial Strain Gradient Effects in Thermo-Mechanical Fatigue of Copper Micro-Structures,” International Journal of Fatigue, Vol. 26(9), pp. 947-957.
  • Pucha, R.V., Tunga, K.,  Pyland, J.,  Sitaraman, S.K.,  2004. Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment. Transactions of the ASME - Journal of Electronic Packaging 126(2), 256-264.