2006

Q. Nie and Y. Joshi, Multiscale Thermal Modeling of Microsystem Enclosure, Proceedings of The 17th International Symposium on Transport Phenomena, September 4-8, 2006, Toyama, JAPAN.

Q. Nie and Y. Joshi, Multi-scale Thermal Modeling Methodology for Electronics Cabinet, Proceedings of ITHERM 2006, May 30-June 2, 2006, San Diego, CA.

D. Gerlach and Y. Joshi, Parametric Thermal Modeling of 3D Stacked Chip Electronics with Interleaved Solid Heat Spreaders, Proceedings of ITHERM 2006, May 30-June 2, 2006, San Diego, CA.

C. Coggins, D. Gerlach, Y. Joshi, and A. Federov, Compact Low Temperature Refrigeration of Microprocessors, Proceedings of the International Refrigeration and Air Conditioning Conference at Purdue University, 2006.

S. Suman, A. Federov, and Y. Joshi, Regenerative Fluid Loop Concept for Performance Enhancement of Adsorption Refrigeration System, Proceedings of the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2006.

2005

D. Gerlach and Y. Joshi, Boiling Performance of Flourinert PF 5060 on Confined and Unconfined Wire Meshes Soldered to the Substrate, Proceedings of the 2005 ASME International Mechanical Engineering Congress and Exposition, November 5-11, 2005, Orlando, FL.

2004

J. Rambo and Y. Joshi, Supply Air Distribution from a Single Air Handling Unit in a Raised Floor Plenum Data Center, Proc. ISHMT/ASME'04 -Joint Indian Society of Heat and Mass Transfer - American Society of Mechanical Engineers Heat and Mass Transfer Conference, Kalpakkam India, 2004.

J. Rambo and Y. Joshi, "Thermal Modeling of Technology Infrastructure Facilities: A Case Study of Data Centers", to appear in: The Handbook of Numerical Heat Transfer, Vol. 2,  W.J. Minkowycz, E.M. Sparrow, and J.Y. Murthy Editors, John Wiley, 2004.

Y. Joshi, Liquid Cooling of High-Performance Microcomponents and Microsystems Miniature Flow Loops for Thermal Management, Advanced Packaging, Vol. 13 No. 1, 35-36, January 2004.

S. Murthy, Y. Joshi, and W. Nakayama, Two-Phase Heat Spreaders Utilizing Microfabricated Boiling Enhancement Structures, Heat Transfer Engineering, Vol. 25 No. 1, 26-36, January/February 2004.

J. Cook, Y. Joshi, and R. Doraiswami, Interconnect Thermal Management of High Power Packaged Electronic Architectures, Annual IEEE Semiconductor Thermal Measurement and Management Symposium-Proceedings 2004, Vol. 20, 30-37, 2004.

S. Suman, A. Federov, and Y. Joshi, Cryogenic/Sub-Ambient Cooling of Electronics: Revisited, Thermomechanical Phenomena in Electronic Systems-Proceedings of the Intersociety Conference, Vol. 1, 224-231, 2004.

M. Patterson, X. Wei, Y. Joshi, and R. Prasher, Numerical Study of Conjugate Heat Transfer in Stacked Microchannels, Thermomechanical Phenomena in Electronic Systems-Proceedings of the Intersociety Conference, Vol. 1, 372-380, 2004.

S. Gurrum, Y. Joshi, W. King, and K. Ramakrishna, Numerical Simulation of Electron Transport Through Constriction in a Metallic Thin Film, IEEE Electron Device Letters, Vol. 25 No. 10, 696-698, October 2004.

X. Wei and Y. Joshi, Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components, ASME Transactions Journal of Electronic Packaging, Vol. 126 No. 1, 60-66, March 2004.

2003

J. Rambo and Y. Joshi, Multi-scale Modeling of High Power Density Data Centers, Advances in Electronic Packaging, Vol. 1, 521-527, 2003.

J. Rambo and Y. Joshi, Physical Models in Data Center Airflow Simulations, ASME Heat Transfer Division, Vol. 374 No. 2, 153-159, 2003.

S. Moghaddam, M. Rada, A. Shooshtari, M. Ohadi, and Y. Joshi, Evaluation of Analytical Models for Thermal Analysis and Design of Electronic Packages, Microelectronics Journal, Vol. 34, 223- 230, 2003.

C. Ramaswamy, Y. Joshi, W. Nakayama, Effects of Varying Geometrical Parameters On Boiling From Microfabricated Enhanced Structures, ASME Journal of Heat Transfer, Vol. 125, 103-109, 2003.

C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Semi-Analytical Model for Boiling from Enhanced Structures, International Journal of Heat and Mass Transfer, 2003.

O. Suzuki, Y. Joshi, and W. Nakayama, Dynamics of a Liquid Plug in a Capillary Duct Powered by Vapor Explosion, Microelectronics Journal, Vol. 34 No. 3, 195-200, March 2003.

L. Yuan, Y. Joshi, and W. Nakayama, Effect of Condenser Location and Imposed Circulation on the Performance of a Compact Two-Phase Thermosyphon, Microscale Thermophysical Engineering, Vol. 7 No. 2, 163-179, April/June 2003.

X. Wei and Y. Joshi, Optimization Study of Stacked Micro-channel Heat Sinks for Micro-electronic Cooling, IEEE Transactions on Components and Packaging Technologies, Vol. 26 No. 1, 55-61, March 2003.

Y. Joshi and S. Garimella, Thermal Challenges in Next Generation Electronic Systems, Microelectronics Journal, Vol. 34 No. 3, 169, March 2003.

P. R. Kaczorowski, Y. Joshi, and S. Azarm, Multi-objective Design of Liquid Cooled Power Electronic Modules for Transient Operation, Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 215-222, 2003.

C. Amon, K. Ramakrishna, B. Sammakia, and Y. Joshi, Special Section on Components and Packaging Technologies with Contributions from ITherm 2002 Thermal Management Track, IEEE Transactions on Components and Packaging Technologies, Vol. 26 No. 1, 3-5, March 2003.

Y. Joshi, K. Azar, D. Blackburn, C. Lasance, R. Mahajan, and J. Rantala, How Well Can We Assess Thermally Driven Reliability Issues in Electronic Systems Today? -Summary of Panel Held at the Therminic 2002, Microelectronics Journal, Vol. 34 No. 12 Special Issue, 1195-1201, December 2003.

K. Moores and Y. Joshi, Effect of Tip Clearance on the Thermal and Hydrodynamic Performance of a Shrouded Pin Fin Array, ASME Journal of Heat Transfer, Vol. 125 No. 6, 999-1006, December 2003.

S. Gurrum, S. Suman, Y. Joshi, and A. Fedorov, Thermal Issues in Next Generation Integrated Circuits, Advances in Electronic Packaging, Vol. 2, 659-664, 2003.

C. Ghiu and Y. Joshi, Boiling Performance of Single-Layered Enhanced Structures, ASME Heat Transfer Division, Vol. 374 No. 2, 175-181, 2003.

S. Gurrum, Y. Joshi, W. King, and K. Ramakrishna, A Novel Compact Method for Thermal Modeling of On-Chip Interconnects Based on the Finite Element Method, ASME EEP, Vol. 3 441-445, 2003.

L. Tang and Y. Joshi, A Multigrid Based Multi-Scale Thermal Analysis Approach for Conjugate Problems Involving Discrete Heating, ASME EEP, Vol. 3, 539-552, 2003.

2002

S. Garimella and Y. Joshi, Foreward-Contributions from Thermal Challenges in Next Generation Electronic Systems (THERMES), IEEE Transactions on Components and Packaging Technologies, Vol. 25 No. 4, 567-568, 2002.

S. Garimella, Y. Joshi, A. Bar-Cohen, R. Mahajan, K.C. Toh, V.P. Carey, M. Baelmans, J. Lohan, B. Sammakia, F. Andros, Thermal Challenges in Next Generation Electronic Systems - Summary of Panel Presentations and Discussions, IEEE Transactions on Components and Packaging Technologies, Vol. 25 No. 4, 569-575, 2002.

S. Gurrum, Y. Joshi, and J. Kim, Thermal Management of High Temperature Pulsed Electronics Using Metallic Phase Change Materials, Numerical Heat Transfer Part: A, Vol. 42 No. 8, 777-790, 2002.

S. Gurrum, S. Murthy, and Y. Joshi, Numerical Simulation of Thermocapillary Pumping Using Level Set Method, 5^th ISHMT/ASME Heat and Mass Transfer Conference, January 3-5, Kolkata, India, 2002.

Y. Joshi, W. Nakayama, and S. Haider, A Natural Circulation Model of the Closed Loop, Two-phase Thermosyphon for Electronics Cooling,  Journal of Heat Transfer, Vol. 124 No. 5, 881-890, 2002.

S. Kalahasti and Y. Joshi, Performance Characterization of a Novel Flat Plate Micro Heat Pipe Spreader, IEEE Transactions on Components and Packaging Technologies, Vol. 25, 554-560, 2002.

A. Pal, Y. Joshi, M. Beitelmal, C. Patel, and T. Wenger, Design and Performance Evaluation of a Compact Thermosyphon, IEEE Transactions of Components and Packaging Technologies, Vol. 25 No. 4, 601-607, 2002.

C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, High Speed Visualization of Boiling from an Enhanced Structure, International Journal of Heat and Mass Transfer, Vol. 45, 4761-4771, 2002.

E. Yu, and Y. Joshi, Heat Transfer Enhancement from Enclosed Discrete Components Using Pin-Fin Heat Sinks, International Journal of Heat and Mass Transfer, Vol. 45, 4957-4966, 2002.

S. Murthy, Y. Joshi, and W. Nakayama, Single Chamber Compact Two-Phase Heat Spreaders with Microfabricated Boiling Enhancement Structures, IEEE Transactions on Components and Packaging Technologies, Vol. 25 No. 1, 156-163, March 2002.

X. Wei and Y. Joshi, Optimization Study of Stacked Micro-channel Heat Sinks for Micro-electronic Cooling, Thermomechanical Phenomena in Electronic Systems-Proceedings of the Intersociety Conference, 441-448, 2002.

2001

Y. Joshi, Heat Out of Small Packages, Mechanical Engineering, 56-58, December 2001.

S. Suman, M. Gaitan, Y. Joshi, and G. Harman, Wire Bond Temperature Sensor, IMAPS International Symposium on Microelectronics, October 9-11, Baltimore, 344-349, 2001.

K. Moores, Y. Joshi, and G. Schiroky, Thermal Characterization of a Liquid Cooled AlSiC Base Plate with Integral Pin Fins, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, 213-219, 2001.

K. Moores and Y. Joshi, High Performance Packaging Materials for Improved Thermal Management of Power Electronics, Future Circuits International, Issue 7, 45-49, 2001.

L. Yuan, Y. Joshi, and W. Nakayama, Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon, Proceedings of 2001 International Mechanical Engineering Congress and Exposition, HTD-Vol. 369 No. 7, 291-299, 2001.

Y. Joshi, M. Baelmans, D. Copeland, C.J.M. Lasance, J. Parry, and J. Rantala, Challenges in Thermal Modeling of Electronics at the System Level: Summary of Panel Held at the Therminic 2000, IEEE Transactions on Components and Packaging Technologies, Vol. 24 No. 4, 611-613, December 2001.

C. Ghiu, Y. Joshi, and W. Nakayama, Visualization Study of Pool Boiling from Transparent Enhanced Structures, Proceedings of the National Heat Transfer Conference, Vol. 1, 697-704, 2001.

Q. Zhang, Y. Joshi, A. Dasgupta, and R. Pal, Modeling of Effects of Geometry and Temperature Cycle on Viscoplastic Deformation and Durability of FCOC Solder Joints, Advances in Electronic Packaging, Vol. 1, 315-322, 2001.

D. Yoo and Y. Joshi, Smart Thermal Management Systems Based on Solid Liquid Phase Change Materials (PCM), Advances in Electronic Packaging, Vol. 2, 601-607, 2001.

S. Bhavnani, A. Bar-Cohen, and Y. Joshi, Evolution and Growth of a Web-Based Electronics Thermal Management Course, Advances in Electronic Packaging, Vol. 3, 1831-1836, 2001.

S. Haider, Y. Joshi, and W. Nakayama, A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling, ASME Heat Transfer Division, Vol. 369 No. 7, 209-218, 2001.

2000

Lang, Y., Joshi, Y. K. and Nakayama, W., Effect of Condenser Location and Imposed Circulation on the Performance of a Compact Two-Phase Thermosyphon, Engineering Foundation Conference on Heat Transfer and Transport Phenomena for Microsystems, Banff, Alberta, Canada, October 15-20, 2000, 304-311.
 

E. Yu and Y. Joshi, Natural Convection Air Cooling of Electronic Components in Partially Open Compact Horizontal Enclosures, IEEE Transactions on Components and Packaging Technologies, Vol. 23 No. 1, 14-22, 2000.

Gurrum, S. P., Joshi, Y. K. and Kim, J., Thermal Management of High Temperature Pulsed Electronics Using Phase Change Materials, Proceedings of the 34th National Heat Transfer Conference, Pittsburgh, PA, Aug. 20-22, 2000.

C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon, IEEE Transactions on Component and Packaging Technology, Vol. 23, No.1, 61-69, 2000.

K. Moores, Y. Joshi, and G. Schiroky, Numerical and Experimental Thermal Characterization of a Liquid Cooled AlSiC Power Electronics Base Plate With Integral Pin Fins, Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems (ITherm), Vol. 2, 385-390, 2000.

S. Murthy, Y. Joshi, and W. Nakayama, Single Chamber Compact Thermosyphons with Micro-Fabricated Components, Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems (ITherm), Vol. 2, 321-327, 2000.

Y. Joshi, J. Sircar, A. Bar-Cohen, K. Geisler, S. Bhavnani, P. Pradeepkumar, and J. Barnes, Distance Learning in Thermal Design of Electronic Systems: The IEEE/NSF Project, Proceedings-Electronic Components and Technology Conference, 1289-1292, 2000.

D. Pal and Y. Joshi, Melting in a Side Heated Tall Enclosure By a Uniformly Dissipating Heat Source, International Journal of Heat and Mass Transfer, Vol. 44 No. 2, 375-387, 2000.

S. Smee, M. Gaitan, D. Novotny, Y. Joshi, and D. Blackburn, IC Test Structures for Multilayer Interconnect Stress Determination, IEEE Electron Device Letters, Vol. 21 No. 1, 12-14, 2000.

S. Bhavnani, A. Bar-Cohen, and Y. Joshi, The Classroom of the Future: An Internet-Delivered National Course on Thermal Management of Electronics, Journal of Engineering Education, Vol. 89 No. 4, 423-427+503+506, October 2000.

1999

K. Moores, Y. Joshi, and G. Miller, Performance Assessment of Thermoelectric Coolers for Use in Thermal Management of High Temperature Electronics Systems, Proceeding of the 18th International Conference on Thermoelectrics, Baltimore, MD, August 1999.

S. Murthy, Y. Joshi, V. Adams, and K. Ramakrishna, Integrated Thermal Analysis of an Automotive Electronic System, Proceedings of InterPACK'99, vol.1, 979-986, June 1999.

D. Pal and Y. Joshi, Thermal Control of Horizontally Mounted Heat Sources Using Phase Change Materials, ASME EEP, Vol. 26-2, 1625-1630, 1999.

L. Tang and Y. Joshi, Multi-scale Conjugate Thermal Modeling Approach for Air Cooled Electronic Enclosures, ASME EEP, Vol. 26-1, 295-304, 1999.

L. Tang and Y. Joshi, Application of Block-Implicit Multigrid Approach To Three-Dimensional Heat Transfer Problems Involving Discrete Heating, Numerical Heat Transfer; Part A: Applications, Vol. 35 No. 7, 717-734, 1999.

C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Thermal Performance of a Compact Two-Phase Thermosyphon: Response to Evaporator Confinement and Transient Loads, Journal of Enhanced Heat Transfer, Vol. 6 No. 2-4, 279-288, 1999.

Y. Joshi, A. Bar-Cohen, and S. Bhavnani, Internet Based Instruction for Thermal Design of Electronic Products-Making A Global Impact, Proceedings-Electronic Components and Technology Conference, 1060-1064, 1999.

R. Pappu, Y. Joshi, and A. Dasgupta, Localized Thermal Cycling: A Faster and Controlled Accelerated Testing Approach for Surface Mount Electronics, ASME EEP, Vol. 26-2, 1599-1604, 1999.

1998

Y. Joshi, "Passive Thermal Control of Electronic Equipment", chapter 8 of Applied Computational Fluid Dynamics, V. K. Garg (ed.), Marcel Dekker, pp.301-333, 1998.

D. Pal, and Y. Joshi, Transient Thermal Management of an Avionics Module Using Solid-Liquid Phase Change Materials (PCMs), AIAA Journal of Thermophysics and Heat Transfer, Vol. 12, 256-262, 1998.

Y. Joshi, A. Bar-Cohen, and S. Bhavnani, National Course on Thermal Design of Electronic Products: Recent Experiences and a Proposal, Proceedings-Electronic Components and Technology Conference, 541-543, 1998.

E. Yu and Y. Joshi, Natural Convection Air Cooling of Electronic Components in Partially Open Compact Horizontal Enclosures, Thermomechanical Phenomena in Electronic Systems-Proceedings of the Intersociety Conference, 51-57, 1998.

L. Tang and Y. Joshi, Application of Block-Implicit Multigrid Approach to Heat transfer Problems Involving Discrete Heating, International Mechanical Engineering Congress and Exposition, ASME HTD-Vol. 361, 23-32, 1998.

T. Shah, S. Danziger, K. Moores, and Y. Joshi, Cyanate Ester Die Attach Material for Radiation Hardened Electronic Packages, IEEE Adhesives in Electronics Symposium, Binghamton, N.Y. September 1998.

L. Tang, K. Moores, C. Ramaswamy, and Y. Joshi, Characterizing the thermal performance of a flow through electronic module (SEM-E Format) using a porous media model, Proceedings of the IEEE SEMITHERM XIV Symposium, San Diego, CA, 68-77, March 1998.

C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Performance of a Compact Two-Chamber Two-Phase Thermosyphon: Effect of Evaporator Inclination, Liquid Fill Volume and Contact Resistance, Proceedings of the International Heat Transfer Conference, Kyongju, South Korea, 1998.

C. Ramaswamy, Y. Joshi, W. Nakayama, and W. Johnson, Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon, Proceedings of ITherm VI, Seattle, WA, 349-355, 1998.

S. Smee, M. Gaitan, and Y. Joshi, MEMS-Based Test Structures for IC Technology, Mechanical Behavior of Advanced Materials, ASME MD-Vol. 84, 147-149, 1998.

1997

D. Pal and Y. Joshi, Application of Phase Change Materials (PCMs) to the Passive Thermal Control of a Plastic Quad Flat Packages,  Thermal Management of Electronic Systems II, Kluwer Academic Publishers, Leuven, Belgium, 227-242, 1997.

D. Pal and Y. Joshi, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study, Journal of Electronic Packaging, Transactions of ASME, Vol. 119, 40-50, 1997.

E. Yu and Y. Joshi, Effects of Orthotropic Thermal Conductivity of Substrates in Natural Convention Cooling of Discrete Heat Sources, Numerical Heat Transfer, Vol. 32, 575-593, 1997.

Y. Joshi, A. Bar-Cohen, and S. Bhavnani, Distance Learning Paradigms in Electronics Packaging: A National Course on Thermal Design of Electronic Products, Proceedings-Electronic Components and Technology Conference, 579-584, 1997.
 

V. Adams, D. Blackburn, Y. Joshi, and D. Berning, Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems, IEEE Transaction on Components, Packaging, and Manufacturing Technology Part A, Vol. 20, No. 4, 420-431, 1997.

L. Tang, and Y. Joshi, Integrated Thermal Analysis of Indirect Air-Cooled Electronic Chassis, IEEE Transaction on Components, Packaging, and Manufacturing Technology Part A, Vol. 20, No. 2, 103-110, 1997.

Y. Joshi, D. Barker and M. Ojalvo, New Graduate Educational Program in Electronic Packaging and Reliability (EPAR), Journal of Engineering Education, Vol. 86 No. 2, 183-187, 1997.

1996

E. Yu and Y. Joshi, Air Cooling of a Vented Enclosure by Combined Conduction, Natural Convection and Radiation, Proceedings of the ASME International Mechanical Engineering Congress and Exposition, Atlanta, GA, HTD-Vol. 333, 323-330, 1996.

1995