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Ongoing Research Projects
Hybrid Solid-State/ Fluidic Solution for Hot Spot Removal Vivek Sahu Sponsor: MARCO/DARPA/Interconnect Focus Center
Thermal Implications of the Next Generation Interconnects Dr. Yoon Jo Kim Sponsor: MARCO/DARPA/Interconnect Focus Center
Visualization of Pool Boiling From Stacked Enhancement Structure Camil-Daniel Ghiu Sponsor: DARPA
Modeling of High Power Density Data Centers Graham Nelson Sponsor: CEETHERM
Reduced Order Modeling of Thermal Systems Emad Samadiani Sponsor: CEETHERM/Office of Naval Research (ONR)
Design of Thermal Management Systems for Electronics Used in Oil Well Drilling Ashish Sinha Sponsor: Halliburton Energy Services
Forced Convection in Microchannels Enhanced with Nanostructures Carter Dietz Sponsor: CEETHERM
Cryogenic Cooling of Electronics Shivesh Suman Sponsor: MARCO/DARPA/Interconnect Focus Center
Nanoscale Thermal Characterization of Metallic Interconnects Adam Whelan Sponsor: Semiconductor Research Corporation (SRC)
Experimental and Numerical Study of a Dual Chamber Thermosyphon Aniruddha Pal Sponsor: Packaging Research Center
Multi-scale Thermal Modeling Methodology for Electronic Enclosures Qihong Nie Sponsor: Office of Naval Research (ONR)
Development of Cooling Methods for
3D Electronics
Compact, Low Temperature Refrigeration of Microprocessors Lee Coggins Sponsor: MARCO/DARPA/Interconnect Focus Center
Recently Completed Research Projects
Hot-Spot Management Using Microscale Evaporative Cooling Hot-Spot Management Using Fluid-to-Fluid Spot-to-Spreader (FFSS) Technique Forced convection Thermal Management of Microprocessors Using Carbon Nanotube Fins Dr. Prajesh Bhattacharya Sponsor: MARCO/DARPA/Interconnect Focus Center
Pool Boiling From Surfaces With Carbon Nanotube Micro-Structures Dr. Prajesh Bhattacharya Sponsor: MARCO/DARPA/Interconnect Focus Center
Modeling of High Power Density Data Centers Jeff Rambo Sponsor: CEETHERM
Reduced Order Modeling of Thermal Systems Jeff Rambo and Nathan Rolander Sponsor: CEETHERM/Office of Naval Research (ONR)
Thermal Modeling and Characterization of Nanoscale Metallic Interconnects Dr. Siva P. Gurrum Sponsor: Semiconductor Research Corporation (SRC)
Robust Configuration of Data Center Server Cabinets for Thermal Efficiency Nathan Rolander Sponsor: CEETHERM
Design of On-chip Compact Evaporators for Ultra-low Temperature Chip Operation Robert Wadell Sponsor: MARCO/DARPA/Interconnect Focus Center
Hybrid Micro-nano Structures for Boiling Heat Transfer Enhancement Dr. Xiaojin Wei Sponsor: MARCO/DARPA/Interconnect Focus Center
Porous Coldplates as a High Heat Flux Electronics Cooling Solution Scott Wilson Sponsor: ONR/Foster-Miller, Inc.
Thermal Management of Portable Electronics Dr. Sang Hee Park Sponsor: Georgia Tech Foundation
Compact Two-phase Indirect Liquid Cooling of a Laptop Computer Adya Ali Sponsor: Institute of Microelectronics, Singapore
Innovative Thermal Management of Electronics Used in Oil Well Logging Juan-Carlos Jakaboski Sponsor: Halliburton Energy Services
Flat Plate Thermosyphons for Space Constrained Applications Sponsor: Semiconductor Research Corporation (SRC)
Metal Matrix Composites for Thermal Management of Power Electronics Kevin Moores Sponsor: DMc2 Corporation
Single Phase Micro-Fluid Loop for Cooling of Microelectronic Devices Dr. Xiaojin Wei Sponsor: Intel
Thermal Management of High Power System-On-Package Architectures Jason Cook Sponsor: Packaging Research Center
Molecular Dynamics Simulation of Boiling Dr. Cherif Ould Lahoucine Sponsor: Fulbright Fellowship
Thermal Management of Advanced Interconnects Dr. Stephane Launay and MITf Sponsor: MARCO/DARPA/Interconnect Focus Center
Computations of Thermal Management Systems for Offshore Oil Exploration Electronics Dr. Qinghua Wang Sponsor: Halliburton Energy Services |
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