Single Phase Micro-Fluid Loop for Cooling of Microelectronic Devices

Xiaojin Wei

Background

Cooling of microelectronic components is one of the critical issues as the devices are becoming more compact in size yet more powerful in performance as indicated in the ITRS roadmaps.  New techniques are being developed here in our lab and elsewhere to address this issue. This project in particular studies microchannel liquid cooling for microprocessors and devices with similar power density. High heat transfer coefficients and compact size are two major advantages of microchannel cooling.  On the other hand pressure drop penalty and temperature non-uniformity remain the two major issues. In this work we proposed stacked microchannel concept to address these issues.

Objectives

• Develop stacked microchannel heat sinks for the micro-fluid loop.
• Experimentally demonstrate the validity of the proposed stacked microchannel concept.
• Study of flow inside microchannel using Micro-PIV.

Current Work

Stacked microchannel structures have been fabricated using Micro-machining techniques. Experiment setup is developed to test the thermal performance of the stacked microchannel of different configurations.

Modeling results of different configurations of the stacked microchannel

Sponsor

This project is supported under the DARPA HERETIC Program through contract N00164-99-C-0039 and Intel Corp.

 

	Home	Laboratory	CEETHERM	Projects	Publications	Personnel	Announcements	Visiting Us
	Copyright © 2005 by Yogendra Joshi