M2000-241

INTEGRATED MESOSCOPIC ELECTRO-MECHANICAL MANUFACTURING

Liwei Lin
Mechanical Engineering Department, University of California at Berkeley, Berkeley, CA 94720-1740

Abstract

Motivated by the needs of mesoscopic electro-mechanical manufacturing, this research focuses on the integration of the mesoscopic electro-mechanical systems. The manufacturing concept is based on microreplications, batch processing and integration. Advanced micromachining or mechanical machining processes are applied to make precision mold inserts. Microreplication takes place to duplicate mesoscopic structures by using micro hot embossing, ceramic structural formation or micro electroplating processes. At the end, selective electroplating and bonding process is developed for the integration of mesoscopic mechanical structures with microelectronics. Preliminary results of individual process modules including silicon mold inserts, plastic replications, electroplated structural layers as well as the final integration by selective electroplating are presented. A mesoscopic gripper that has successfully operated after completing the mesoscopic electro-mechanical manufacturing process is also presented.

Liwei Lin
Mechanical Engineering Department
University of California at Berkeley
Berkeley, CA 94720-1740
Email: lwlin@me.berkeley.edu