ME 7228: Thermo-Mechanical Reliability in Electronic Packaging-Modeling and Validation
Offered Spring, Odd Years

 

Credit Hours:  3-0-3
Prerequisites:  ME 6124 (Finite-Element Method: Theory and Practice) and ME 6222 (Manufacturing Processes and Systems)
Catalog Description: Modeling and validations of thermomechanical behavior of printed wiring board and PWB Assembly, including: microelectronic packaging, packaging materials, manufacturing process modeling, reliability, failure modes.
Textbook:
John H. Lau, Thermal Stress and Strain in Microelectronic Packaging, Van Nostrand Reinhold, 1993
Instructors Suresh Sitaraman (ME) and Charles Ume (ME)
References:
R. Tummala and E. Rymaszewski, Microelectronics Packaging Handbook, Van Nostrand Reinhold, 1996
 
Michael G. Pecht, Luu T. Nguyen, Edward B. Hakim, Plastic-Encapsulated Microelectronics : Materials, Processes, Quality, Reliability, and Applications, Wiley, 1995
Goals:
  • To provide an in-depth understanding of the thermo-mechanical modeling and validation aspects of microelectronic packages;
  • to expose students to various qualification techniques in electronic packaging, failure modes in electronic packaging, electronic packaging materials, and process modeling techniques;
  • to provide hands-on exposure to experimental techniques in packaging reliability.
    • Prerequisites by topics:

    Topics:
     

    Introduction to Microelectronic Packaging
    - Packaging Hierarchy
    - Types of Packaging - Insertion, SMT, DCA
    Packaging Materials
    - Substrate
    - Interconnect
    - Encapsulants
    - Molding Compounds
    - Passivation
    Reliability Issues associated with Service Conditions
    - Automotive
    - Aerospace
    - Telecommunications
    - Computer
    - Consumer
    - Military
    Manufacturing Processes and Reliability Issues
    - Substrate Fabrication Process
    - Solder Reflow Process
    Qualification Techniques
    - Qualification Process
    - Accelerated Testing
    - Thermal Cycling, Shock, Steady-State
    - Humidity test
    Failure Modes
    - Warpage
    - Delamination
    - Fatigue Crack Propagation
    - Brittle Fracture, Ductile Fracture
    Thermo-Mechanical Modeling
    - Material and Geometry Modeling
    - Substrate
    - Package - SMT, Insertion, DCA
    Experimental Validation Approaches
    - SAM
    - X-Ray
    - Laser
    - Electron Microscopy
    - Moiré Interferometer
    - Ultrasound
    Industrial Interactions
    As part of industrial interaction, at least two visits to local electronic industry will be arranged. Alternatively, at least two thermo-mechanical reliability and validation experts from industry will be invited to give guest lectures.

    Delivery Mode
     
    Lecture  80%
    Supervised Lab  
    Discussion 20%
    Grading Scheme  
    Homework 20%
    Midterm 25%
    Final Exam 25%
    Project 30%

    Thermo-Mechanical Reliability in Electronic Packaging - Modeling and Validation

    Proposed Course Outline
    Topic
    Instructor
    Introduction to Microeelctronic Packaging Sitaraman
    Packaging Materials Sitaraman
    Reliability Issues Associated with Service Conditions Sitaraman
    Manufacturing Processes and Reliability Issues Ume
    Qualification Techniques Ume
    Failure Modes Ume
    Midterm Examination Ume/Sitaraman
    Thermo-Mechanical Modeling Sitaraman
    Experimental Validation Approaches Ume
    Final Examination Sitaraman/Ume

    16. Full justification of request

    Dramatic changes are underway in the computer, telecommunication, automotive, and consumer electronics industries. The common and pervasive requirements of these electronics industries are: (1) ultra-low cost, (2) thin, light, and portable, (3) high performance, and (4) diverse functions. With continued increase in performance and with continued miniaturization of components, thermo-mechanical reliability of electronic packages is a key concern in the Microelectronics Industry. To address thermo-mechanical reliability, scientists/engineers should have a broad exposure to electronic materials and their properties, manufacturing and operating conditions, failure modes, and several modeling and experimental techniques.

    The presence of the Packaging Research Center, Manufacturing Research Center, and Microelectronics Research Center have stimulated significant research interest among graduate students in various aspects of electronic packaging. However, there is no comprehensive course offered today that addresses the needs of those students who wish to pursue research/career in the area of Thermo-Mechanical Reliability of Electronic Packages.

    The proposed graduate-level course entitled "Thermo-Mechanical Reliability in Electronic Packaging - Modeling and Validation" will address this deficiency. As shown in the outline, this course will expose students to various qualification techniques in electronic packaging, failure modes in electronic packaging, thermo-mechanical modeling, and experimental techniques to assess reliability.

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    Revised July 2004