ME 6226: Fundamentals of Semiconductor
Manufacture and Assembly
Offered as Required
| Credit
Hours: |
3-0-3 |
| Prerequisite:
|
ME
6222 or equivalent, or with the consent of the instructor |
- Catalog Description:
|
- Basic mechanical
and materials processes in production including silicon boule growth,
plastic encapsulation, interconnect metal migration, solder joining,
printing, manufacturing process cost analysis.
|
- Textbooks:
|
- Rao
R. Tummala and Eugene J. Rlymaszewski, Microelectronics
Packaging Handbook: Part 2 Semiconductor Packaging; 2nd Edition,
Chapman and Hall, 1997.
Donald P. Seraphim, Ronalld C. Lasky, and Che-Yu
Li Principles of Electronic Packaging, 1st Edition,
McGraw-Hill, 1989.
|
| Instructor: |
Daniel
F. Baldwin |
- Goals:
This course is
designed to provide a fundamental background for graduate and senior undergraduate
students in a rapidly growing field for mechanical and manufacturing engineers,
namely electronics manufacturing. This highly cross disciplinary field involves
numerous mechanical and materials processes beyond those typically covered
at the undergraduate level. This course will build on the undergraduate
principles and focus on key materials processes through detailed analytical
treatments providing the tools necessary for process system design. An integral
component to the course will be a group project that will enable students
to integrate the fundamental principles on practical manufacturing systems.
Prerequisites
by topics:
Topics:
1. Semiconductor
Manufacturing
- Heat Transfer
Analysis of Silicon Boule Growth
- Introduction
to Semiconductor Fabrication
- Analysis of
Mechanical Polishing and Dicing
- Analysis of
Metal Deposition
2. Fundamentals
of Package Processing
- Overview of
Packaging Technology
- Analysis of
Polymer Encapsulation Processing
- Non Newtonian
Flow Analysis
- Mold Design
- PWB and Substrate
Processing Analysis
- Precision Drilling
Analysis
- Analysis of Metal Deposition and Etching
- Composite Laminant Process Analysis
3. Interconnect
Processing
- Introduction
to Interconnect Technologies
- Solid State
Diffusion Analysis and Intermetallic Formation
- Solder Fillet
Formation Analysis
- Modeling Surface
Tension Driven Self-Alignment
- Polymer Adhesives
Processing
4. Assembly Processes
- Introduction
to Through Hole, Surface Mount, and Direct Chip Attach Assembly
- Design for Electronic
Assembly
- Fluid Dynamics
Analysis of Stencil Printing
- Electronic Assembly
Fixturing Analysis
- Assembly System
Design and Optimization
- Line Balancing
Analysis
5. Process Cost
Analysis
- Activity Based
Cost Analysis
- Case Study in
Flip Chip Processing
- Case Study in
SMT vs Chip Scale Packaging
6. Industry Case
Studies (Industry Guest Lectures)
- Build-up Substrate
Technology Selection (G. White, Motorola)
- CIM in Electronics
Assembly (J. Hawthorne, Machine Vision Technologies)
- Failure Modes
in Electronics Packages (L. Kessler, Sonoscan)
- Next Generation
Electronics Packaging and Process Technologies (R. Lasky, Cookson EMD)
Delivery mode
(%):
| Lecture: |
80%
|
| Laboratory |
|
- Supervised
|
|
- Unsupervised
|
|
| Discussion: |
10%
|
| Seminar: |
10%
|
| Independent
Study |
|
| Demonstration |
|
| Other
(specify) |
|
| |
|
| Grading
Scheme (%): |
|
| |
|
| Homework |
15%
|
| Individual
Projects |
25% |
| Group
Projects |
|
| Exams |
60%
|
| Other
(specify) |
|
_______________________
Revised June 2004