PUBLICATION LIST

 

Jianmin Qu

G. W. Woodruff School of Mechanical Engineering

Georgia Institute of Technology

Atlanta, Georgia 30332-0405

Phone: 404-894-5687

Fax: 404-894-0186

E-Mail: jianmin.qu@me.gatech.edu

If you would like a copy of a publication, please e-mail me the category and the number it is listed under. 
Thank you.

 

A.  Published Books and Parts of Books

1.      Pucha, R.V., Qu, J., and Sitaraman, S.K., 2007, “Mixed-Signal Package Reliability” in Introduction to System-on-Package (SOP), ed. R. Tummala, McGraw-Hill, NY. (In Press)

2.      Qu, J. and M. Cherkaoui, 2006, Fundamentals of Micromechanics of Solids, John Wiley & Sons Inc., Hoboken, NJ.

3.      Ferguson, T. and Qu, J., 2006, "The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging," in Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Vol. 2, Physical Design / Reliability and Packaging, Suhir, E.; Lee, Y.C.; Wong, C.P. (Eds.), Springer, Secaucus, NJ, pp. 431 – 469.

4.      Qu, J. and L. Jacobs, 2004, "Cylindrical Waves and Their Applications in Ultrasonic Evaluation," in Ultrasonic NDE for Engineering and Biological Material Characterization, ed. T. Kundu, CRC Press, p.311 – 362.

5.      Qu, J., 2003, “Thermomechanical Reliability of Microelectronic Packaging,” in Comprehensive Structure Integrity – Fracture of Materials from Nano to Macro, ed. W. Gerberich and W. Yang, Elsevier Science, p.219 - 240.

6.      Qu, J. and Guo, Y., 2001 “Fundamentals of Microsystems Reliability,” in Fundamentals of Microsystems Packaging, ed. R. Rummala, McGraw-Hill, p.878 - 923.

7.      Qu, J., 2000, "Nondestructive Evaluation and Characterization of Engineering Materials for Reliability and Durability Predictions, ed., ASME, AMD-Vol240/NDE-Vol. 18.

8.      Yang, L. and Qu, J., 1996, "Energy Release Rate For Cracks on a Non-Planer Interface," in Fracture of Composites, ed. E. Armanios, p.47-62. (SCI).

9.      Qu, J., "Green's Function in Anisotropic Bimaterials, 1992" in Modern Theory of Anisotropic Elasticity and Applications, ed. by J.J Wu, T.C.T. Ting and D.M. Barnett, p. 62 - 73.

10.  Roberts, R.A., Qu, J. and Achenbach, J.D., 1988, "Experimental and Theoretical Analysis of Backscattering Mechanism in Fiber‑Reinforced Composites," in Acousto‑Ultrasonic: Theory and Application, ed. by J. C. Duke, Plenum Press, pp. 151‑164.

 

B. Refereed Publications

1.                  Capolungo, L., Benkassem, S., Cherkaoui, M., and Qu, J., 2008, “Self-consistent Scale Transition with Imperfect Interfaces: Application to Nanocrystalline Materials, Acta Materialia, accepted for publication.

2.                  Pei, M. and Qu, J., 2008, “Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys,” ASME J. Electronic Packaging, accepted for publication.

3.                  Shui, G., Kim, J.Y., Qu, J., Wang, Y.S. and Jacobs, L.J., 2008, “A New Technique for Measuring the Acoustic Nonlinearity of Materials Using Rayleigh Waves,” NDT&E International, accepted for publication.

4.                  Bermesa, C., Kim, J.Y., Qu, J., and Jacobs, L.J., 2008, “Nonlinear Lamb waves for the detection of material nonlinearity,” Mechanical Systems and Signal Processing, Vol. 22, pp. 638–646.

5.                  Dingreville, R., Kulkarni, A., Zhou, M. and Qu, J., 2008, “A Semi-Analytical Method for Quantifying the Size-Dependent Elasticity of Nanostructures,” Modelling and Simulation in Material Science and Engineering, Vol. 16, pp. 025002.

6.                  Jairazbhoy, V., Petukhov, P. and Qu, J., 2008, "Non-Unique Solutions for Large Deflection of Thin Plates in Cylindrical Bending under Certain Mixed Boundary Conditions,” Int. J. Solids and Structures, accepted for publication.

7.                  Su, B. and Qu, J., 2007, “Fatigue Behavior of Electrically Conductive Adhesives,” J. Adhesion Science & Technology, accepted for publication.

8.                  Pei, M. and Qu, J., 2007, “Creep and Fatigue Behavior of SnAg Solders with Lanthanum Doping,” IEEE Transactions on Components and Packaging Technology, accepted for publication.

9.                  Dingreville, R. and Qu, 2007, “Interfacial Excess Energy, Excess Stress and Excess Strain in Elastic Solids - Planar Interfaces,” J. Mech. Phys. Solids, accepted for publication, available online doi:10.1016/j.jmps.2007.11.003 .

10.              Chen, X.J., Kim, J.Y., Kurtis, K.E., Qu, J., Shen, C.W., and Jacobs, L.J., 2008, “Characterization of Progressive Microcracking in Portland Cement Mortar Using Nonlinear Ultrasonic,” NDT & E International, NDT&E International, Vol. 41, pp. 112–118.

11.              Pruell, C., Kim, J.Y., Qu, J., and Jacobs, L.J., 2007, “Evaluation of Plasticity Driven Material Damage Using Lamb Waves,” Applied Physics Letters, Vol. 91, pp. 231911-3.

12.              Bermes, C., Kim, J.Y., Qu, J., Jacobs, L.J., 2007, "Nonlinear Lamb Waves for the Detection of Material Nonlinearity," Mechanical Systems and Signal Processing, accepted for publication, available online doi:10.1016/j.ymssp.2007.09.006.

13.              Pei, M. and Qu, J., 2007, “Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys, J. Electronic Materials, accepted for publication, available online doi:10.1007/s11664-007-0335-x.

14.              Spearot, D.E., Capolungo, L., Qu, J., Cherkaoui, M., 2007, “On the Elastic Tensile Deformation of <100> Bicrystal Interfaces in Copper,” Computational Materials Science, accepted for publication, available online doi:10.1016/j.commatsci.2007.06.008.

15.              Swaminathan, N. and Qu, J., 2007, “Interactions between Non-stoichiometric Stresses and Defect Transport in a Tubular Electrolyte," Fuel Cells, Vol. 7, pp. 453-462.

16.              Koreck, J., Valle, C., Qu, J. and Jacobs, L.J., 2007, "Computational Characterization of Adhesive Layer Properties Using Guided Waves in Bonded Plates," J. Nondestructive Evaluation, Vol. 26, pp. 97–105.

17.              Capolungo, L., Spearot, D.E., Cherkaoui, M., McDowell, D.L., Qu, J., Jacob, K.I., 2007, "Dislocation Nucleation from Bicrystal Interfaces and Grain Boundary Ledges: Relationship to Nanocrystalline Deformation," J. Mech. Phys. Solids., Vol. 55, pp. 2300-2327.

18.              Cui, Z., Sun, Y., Li, J., Qu, J., 2007, “On a Combination Method for the Calculation of Elastic Constants,” Physical Review B, Vol. 75, 214101-1-6.

19.              Cornil, M.B., Capolungo, L., Qu, J. and Jairazbhoy, V.A., 2007, "Free Vibration of a Beam Subjected to Large Static Deflection," J. Sound and Vibration, Vol. 303, pp. 723 –740.

20.              Punurai, W., Jarzynski, J., Qu, J., Kurtis, K.E., Jacobs, L.J., 2007, "Characterization of dissipation losses in cement paste with diffuse ultrasound," Mechanics Research Communications, Vol. 34, pp. 289–294.

21.              Bermes, C., Kim, J. Y. , Qu, J., and Jacobs, L. J., 2007, "Experimental Characterization of Material Nonlinearity using Lamb Waves," Applied Physics Letters, Vol. 90 (2), pp. 021901.

22.              Swaminathan, N. and Qu, J., 2007, "An Electrochemomechanical Theory for Ionic Solids I - Theory," Phil,. Mag., Vol. 87, pp. 1705 - 1721.

23.              Swaminathan, N. and Qu, J., 2007, "An Electrochemomechanical Theory for Ionic Solids II - Examples," Phil. Mag., Vol. 87, pp. 1723 - 1742. 

24.              Johnson, J. and Qu, J., 2007, "An Interaction Integral Method for Computing Mixed Mode Stress Intensity Factors for Curved Bimaterial Interface Cracks in Non-Uniform Temperature Fields," Engineering Fracture Mechanics, Vol. 74, pp. 2282 – 2291.

25.              Punurai, W., Jarzynski, J., Qu, J., Kim, J.Y., Jacobs, L.J., Kurtis, K.E., 2007, "Characterization of Multi-Scale Porosity in Cement Paste by Advanced Ultrasonic Techniques, Cement and Concrete Research, Vol. 37, pp. 38–46.

26.              Capolungo, L, Cherkaoui, M., and Qu, J., 2007, "On the Elastic-Viscoplastic Behavior of Nanocrystalline Materials," Int. J. Plasticity, Vol. 23, pp. 561–591.

27.              Dingreville, R. and Qu, J., 2007, "A Semi-Analytical Method to Compute Surface Elastic Properties, Acta Materialia, Vol. 55, pp.141-147.

28.              Shui, G., Wang, Y., and Qu, J., 2006, "A Theoretical Model for Nondestructive Evaluation of Damage of Adhesive Joints," Key Engineering Materials, Vols. 324-325, pp. 339-342.

29.              Kim, J.-Y., Jacobs, L. J., Qu, J. and Littles, J.W., 2006, "Experimental Characterization of Fatigue Damage in a Nickel-Base Superalloy Using Nonlinear Ultrasonic Waves," J. Acoust. Soc. Am., Vol. 120, pp. 1266 - 1273.

30.              Herrmann, J, Kim, J.Y., Jacobs, L.J., Qu, J., Littles, J.W., and Savage, M., 2006, "Assessment of Material Damage in a Nickel-Base Superalloy Using Nonlinear Rayleigh Surface Waves," J. Appl. Phys., Vo. 99, pp. 124913-1-8.

31.              Kim, J.Y., Qu, J., Jacobs, L.J., Littles, J.W. and Savage, M.F., 2006, "Acoustic Nonlinearity Parameter due to Microplasticity," J. Nondestructive Evaluation, Vol. 25, pp. 28 - 36.

32.              Punurai, W., Jarzynski, J., Qu, J., Kurtis, K.E., Jacobs, L.J., 2006, "Characterization of Entrained Air Voids in Cement Paste with Scattered Ultrasound," NDT & E International, Vol. 39, pp. 514-524.

33.              Ferguson, T. and Qu, J., 2006, "Elastic Modulus Variation due to Moisture Absorption and Permanent Changes Upon Redrying in an Epoxy Based Underfill," IEEE Component and Manufacturing Tech., Vol. 29, pp. 105 – 111.

34.              Junge, M., Qu, J. and Jacobs, L.J., 2006, "Relationship between Rayleigh Wave Polarizations and State of Stress," Ultrasonics, Vol. 44, pp. 233 – 237.

35.              Dingreville, R., Qu, J. and Cherkaoui, M., 2005, "Surface Free Energy and Its Effect on the Elastic Behavior of Nano-sized Particles, Wires and Films," J. Mech. Phys. Solids., Vol. 53, pp. 1827–1854.

36.              Shui, G., Wang, Y. and Qu, J., 2005, "Advances in Ultrasonic Nondestructive Testing and Evaluation of Material Property Degradation," Advances in Mechanics, Vo. 35, pp. 52 – 78.

37.              Capolungo, L., Cherkaoui, M. and Qu, J, 2005, "A self consistent model for the inelastic deformation of nanocrystalline materials," ASME, J. Eng. Mat. Tech., Vol. 127, pp. 400 - 407.

38.              Capolungo, L., Jochum, C., Cherkaoui, M. and Qu, J, 2005, "Homogenization method for strength and inelastic behavior of nanocrystalline materials," Int. J. Plasticity, Vol. 21, pp. 67 - 82.

39.              Sun, Y., G. Wang, and J. Qu, 2005, "On solutions of crack surface opening displacement of a penny-shaped crack in an elastic cylinder subject to tensile loading," J. of Materials Science, Vol. 40, pp. 461-464.

40.              Pucha, R.V., Sitaraman, S.K., Hegde, S., Damani, M., Wong, C.P., Qu, J., Zhang, Z., Raj, P.M., Tummala, R.R., 2004, "Materials and Mechanics Challenges in SOP-based Convergent Microsystems," Micromaterials and Nanomaterials. (A publication series of the Micro Materials Center Berlin (MMCB) at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany, Issue No. 4.

41.              Lee, H.Y. and Qu, J. 2004, Dimple-type failures in a polymer/roughened metal system," J. Adhesion Science and Technology, Vol. 18, No. 10, pp. 1153 - 1172.

42.              Becker, J., Jacobs, L.J. and Qu, J., 2003, “Characterization of Cement-Based Materials using Diffuse Ultrasound,” Journal of Engineering Mechanics,  Vol. 129, No. 12, pp. 1478-1484.

43.              Xue, Y., Jairazbhoy, V.A., Niu, X. and Qu, J., 2003, "Large Deflection of Thin Plates under Certain Mixed Boundary Conditions - Cylindrical Bending," J. Electronic Packaging, Vol. 125, pp 53 – 58.

44.              Ferguson, T. and Qu, J., 2003, "Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials,"  J. Electronic Packaging, Vol. 125, pp 24 – 30.

45.              Lee, H. Y., and Qu., J., 2003, "Microstructure, Adhesion Strength and Failure Path at a Polymer/Roughened Metal Interface," J. Adhesion Science and Technology, Vol. 17, pp 195-215.

46.              Qu, J. and Jacobs, L.J., 2003, "Guided Circumferential Waves and Their Applications in Characterizing Cracks in Annular Components," Materials Evaluation, Vol. 61, pp 85-93.

47.              Xue, Y. and Qu, J., 2003, "On the Energy Release Rate of Elliptical Cracks in Anisotropic Elastic Media," Chinese Journal of Mechanics-Series A, Vol. 19, pp 233-239.

48.              Wang, Y.S., Yu, G.L., Qu, J., 2003, "Subsonic slip waves along the interface between two anisotropic elastic half-spaces in sliding contact with separation, Int. J. Engineering Science, Vol. 41, p. 1785-1798.

49.              Hoiseth, K. and Qu, J., 2003, "Cracking Paths at the Ply Interface in a Cross-Ply Laminate," Composites Part B: Engineering, Vol. 34, pp. 437 – 445.

50.              T. Meurer, Qu., J. and Jacobs, L.J., 2002, "Wave Propagation in Nonlinear and Hysteretic Media - A Numerical Study," Int. J. Solids and Structures, Vol. 39, pp 5585-5614.

51.              Yao, Q. and Qu, J., 2002 "Interfacial versus Cohesive Failure on Polymer-Metal Interface- Effects of Interface Roughness," J. Electronic Packaging, Vol. 124, pp.127 - 134.

52.              Ferguson, T. and J. Qu, 2002, "Effect of Moisture on the Interfacial Fracture Toughness of Underfill/Solder Mask Interfaces," J. Electronic Packaging, Vol. 124, pp.106 - 110.

53.              Qu, J. and Wong, C.P., 2002, “Effective Elastic Modulus of Underfill Material for Flip-Chip Applications,” IEEE Transactions on Components and Packaging Technology, Vol. 25, pp. 53 - 55.

54.              Seifried, R., Jacobs, L.J, Qu, J., 2002, "Propagation of guided waves in adhesive bonded components," NDT and E International, Vol. 35, pp 317-328.

55.              Valle, C., Niethammer, M., Qu, J. and Jacobs, L.J., 2001, “Crack Characterization using Guided Circumferential Waves,” J. Acoust. Soc. Am., Vol. 110, No. 3, pp. 1282-1290.

56.              Niethammer, M., Jacobs, L.J., Qu, J., and Jarzynski, J., 2001, “Time-Frequency Representation of Lamb Waves,” J. Acous. Soc. Am., Vol. 109, No. 5, pp. 1841- 1847.

57.              Bhattacharya, S. K., Sitaraman, S.K., Ume, I.C., Qu, J., Baldwin, D.F., Tummala, R.R., Wong, C.P., 2001, "Large area processing using small area substrates: A low-cost MCM-D thin film processing," Advances in Electronic Packaging, Vol. 3, p. 1443-1448.

58.              Hurlebaus, S., Niethammer, M., Jacobs, L.J. and Valle, C., 2001, “Automated Methodology to Locate Notches with Lamb Waves,” Acoustics Research Letters Online (http://ojps.aip.org/ARLO/index.jsp), Vol. 2, No. 4, pp. 97-102. 

59.              Qu, J., Berthelot, Y. and Jacobs, L., 2000 "Crack Detection in Thick Annular Components Using Ultrasonic Guided Waves," Proc. Instn. Mech. Engrs. Part C, Vol. 214, pp. 1163-1171. (SCI)

60.              Davis, J. E. and Qu, J., 2000, "Numerical Analysis of Fiber Fragmentation in a SiC/Al Single Fiber Composite Specimen," J. Composites Science and Technology, Vol. 60: (12-13) pp. 2297-2307.

61.              Bhattacharya, S., Baldwin, D., Sitaraman, S. Qu, J., Ume, C., and Tummala, R., 2000, "Large area Processing using small area substrates," High Density Interconnect, September 2000, pp 20-25.

62.              Kuhl, A. and Qu, J., 2000, "A Technique to Measure Interfacial Toughness over a Range of Phase Angles," J. Electronic Packaging, Vol. 122, pp. 147 - 151.

63.              Niethammer, M, Jacobs, L., Qu, J., and Jarzynski, J, 2000, "Time-Frequency Representation of Lamb Waves Using the Reassigned Spectrogram, " J. Acoust. Soc. Am., Vol. 107, L19-L24.

64.              Rao, Y., Qu, J. Wong, C.P., and Marinis, T., 2000, "A Precise Numerical Prediction of Effective Dielectric Constant for Polymer-Ceramic Composite Based on Effective-Medium Theory, IEEE Tran. Component and Packaging Technology, Vol. 23, pp. 680 - 683.

65.              Heller, K., Jacobs, L.J. and Qu, J., 2000, "Characterization of Adhesive Bond Properties Using Lamb Waves," NDT & E Int., Vol. 33, pp. 555-563. (SCI)

66.              Bhattacharya, S.,  Gardner, B., Qu, J., Baldwin, D. and Tummala, R., 2000, "Low-cost large area processing using small area substrates - A Novel Multi-tiled Palletization Concept for MCM-D Thin Film Process," IEEE Transactions on Advanced Packaging, Vol. 23, pp. 661 - 671. (SCI)

67.              Olliff, D., Qu, J., Gaynes, M., Kodnani, R., and Zubelewicz, A., 1999, "Characterizing the Failure Envelope of a Conductive Adhesive," J. Electronic Packaging, Vol. 121, p.23-30. (SCI)

68.              Xue, Y. and Qu, J., 1999, "Elliptical Interface Cracks in Anisotropic Bimaterials," Mixed Mode Crack Behavior, ASTM, STP 1359, K. J. Miller and D. L. McDowell, Eds., American Society for Testing and Materials, West Conshohocken, PA, pp. 143 – 159.

69.              Schubert, A., Dudek, R., Leutenbauer, R, Doring, R., Kloeser, J., Oppermann, Michel, B., H., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P. and Tummala, R., 1999, "Does Chip Size Limits Exist for DCA?" IEEE Trans. on Electronic Packaging Manufacturing, Vol. 22, pp. 255 - 263.

70.              Bulsara, V.N., Talreja R. and Qu, J., 1999, "Damage Initiation under Transverse Loading of Unidirectional Composite with Arbitrarily Distributed Fibers," Composite Science & Technology, Vol. 59, p.673-682. (SCI)

71.              Moser, F., Jacobs, L.J. and Qu, J, 1999, “Application of Finite Element Methods to Study Wave Propagation in Wave Guides,” NDT & E Int., Vol. 32, pp 225-234.

72.              Qu, J. and Xue, Y., 1999, “Three-Dimensional Interface Cracks in Anisotropic Bimaterials - The Non-Oscillatory Case,” J. Appl. Mech., Vol. 65, pp.1048 - 1055.

73.              Valle, C., Qu, J. and Jacobs, L. J., 1999, "Guided Circumferential Waves In Layered Cylinders," Int. J. Eng. Science, Vol. 37, pp.1369 – 1387.

74.              Yao, Q. and Qu, J., 1999, "Three-Dimensional vs. Two-Dimensional Finite Element Modeling of Flip Chip Packages," J. Electronic Packaging, Vol. 121, pp.196 – 201. (SCI)

75.              Yao, Q., Qu, J., Wu, J., and Wong, C.P., 1999, “Characterization of Underfill/Substrate Interfacial Toughness Enhancement by Silane Additives,” IEEE Trans. on Electronic Packaging Manufacturing, Vol. 22, pp. 264 - 267.

76.              Kley, M., Valle, C., Jacobs, L. J., Qu, J. and Jarzynski, J., 1999, “Development of Dispersion Curves for Two-Layered Cylinders Using Laser Ultrasonics," J. Acost. Soc. Am., Vol. 106, pp. 582 - 588.

77.              Eisenhardt C., Jacobs, J.J., and Qu, J., 1999, "Application of Laser Ultrasonics to Develop Dispersion Curves for Elastic Plates," J. Appl. Mech., Vol. 66, No., pp. 1043-1045. (SCI)

78.              Liu, G. and Qu, J., 1998, "Guided Circumferential Waves in a Circular Annulus," J. Appl. Mech., Vol. 65, p.424-430.

79.              Liu, G. and Qu, J., 1998, "Transient Wave Propagation in a Circular Annulus Subjected to Impulse Excitation on Its Outer Surface," J. Acost. Soc. Am., Vol. 103, p.1210-1220.

80.              Qu, J. and Hoiseth, K., 1998, "Evolution of Transverse Matrix Cracking in Cross-Ply Laminates," Int. J. Fatigue & Fracture Eng. Materials & Structures, Vol. 21, p.451-464. (SCI)

81.              Qu, J., 1995, "Scattering of Plane Waves from an Interface Crack," Int. J. Engineering Science, Vol. 33, p.179-194.

82.              Littles, J., Jacobs, L. and Qu, J., 1995, “Experimental and Theoretical Investigation of Scattering from a Distribution of Cracks,” Ultrasonics, Vol. 33, p.37-43.

83.              Veazie, D.R. and Qu, J., 1995, "Effects of Interphases on the Transverse Stress-Strain Behavior in Unidirectional Fiber Reinforced Metal Matrix Composites," Composite Engineering, Vol. 5, p. 597-610. (SCI)

84.              Veazie, D.R. and Qu, J., 1995, "Effects of Interphases on the Transverse Stress-Strain Behavior of Fiber Reinforced Metal Matrix Composites," ACTA Mechanica Solida Sinica, Vol. 8, p.625-628,

85.              Qu, J., 1994, "Interface Crack Loaded by Time Harmonic Plane Waves," Int. J. Solids & Structures, Vol. 31, p. 329 - 345.

86.              Qu, J. and Bassani, J.L., 1993, "Fracture Mechanics of Interface Cracks in Anisotropic Materials," J. Appl. Mech., 60, p.422 - 431. (SCI)

87.              Qu, J., 1993, "Eshelby Tensor for an Elastic Inclusion with Slightly Weakened Interface," J. Appl. Mech., 60, p.1048 - 1050.

88.              Yang, L. and Qu, J., 1993, "Fracture Mechanics Parameters for Cracks on Slightly Undulating Interfaces," Int. J. Fracture, 64, p.79-91.

89.              Qu, J., 1993, "Effects of Slightly Weakened Interfaces on the Overall Elastic Properties of Composite Materials," Mechanics of Materials, 14, p.269 - 281.

90.              Bassani, J.L., and Qu, J., 1992 "Fracture Parameters for Interface Cracks," ASTM, Special Technical Publication, 1131, p.549 - 559.

91.              Qu, J., Bassani, J.L., and Li, Q.Q., 1992, "Interfacial Dislocation in Anisotropic Bimaterials," ASTM, Special Technical Publication, 1131, p.578 - 589.

92.              Qu, J. and Li, Q.Q., 1991, "Interfacial  Dislocation and Its Application to Interface Cracks in Anisotropic Bimaterials," J. Elasticity, 26, p.169 - 195.

93.              Qu, J., and Bassani, J.L., 1989, "Cracks on Bimaterial and Bicrystal Interfaces," J. Mech. Phys. Solids, 37, p.417‑434. (SCI)

94.              Bassani, J.L. and Qu, J., 1989, "Finite Crack on Bimaterial and Bicrystal Interfaces," J. Mech. Phys. Solids, 37, p.435‑453. (SCI)

95.              Bassani, J.L. and Qu, J., 1989, "On Elasticity Solutions for Cracks on Bimaterial and Bicrystal Interfaces," Materials Science and Eng., A107, p.177‑184. (SCI)

96.              Qu, J., 1989, "Discussion of General Solutions of a Central Crack in a Strip Sandwiched Between Two Different Outer Layers," Engineering Fracture Mechanics, 32, p.163‑165.

97.              Qu, J., Achenbach, J.D. and Roberts, R.A., 1989, "Reciprocal Relations for Transmission Coefficients: Theory and Application," IEEE Trans., Ultrasonics, Ferroelectrics and Frequency Control, 36(2), p.280‑286.

98.              Achenbach, J.D. and Qu, J., 1986, "Resonant Vibration of Submerged Beam," J. Sound and Vibration, 105, p.185‑195.

 

 


C. Other Publications

1.                  Pei, M. and Qu, J., 2007, "Effect of Rare Earth Elements on Lead-Free Solder Microstructure Evolution," Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07, 2007, p 198-204.

2.                  Pei, M. and Qu, J., 2007, "Hierarchal Modeling of Sn/Ag Solder Alloys," Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07, 2007, p 273-277.

3.                  Pei, M. and Qu, J., 2007, "Constitutive Modeling of Sn/Ag and Sn/Ag/Cu Solder Alloys," IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp. 118.

4.                  Tummala, R., Wong, C.P., Qu, J., Sitaraman, S., Raj, P.M., 2007, "Future of Packaging and packaging materials," IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interface, pp. 57.

5.                  Su, B. and Qu, J., 2007, "Electrical and thermomechanical Modeling of Electrically Conductive Adhesives," IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp. 69.

6.                  Swaminathan, N. and Qu, J., 2006, "A mechanical-electrochemical theory of defects in ionic solids," Ceramic Engineering and Science Proceedings, v 27, n 4, Advances in Solid Oxide Fuel Cells II - A Collection of Papers Presented at the 30th International Conference on Advanced Ceramics and Composites, p.125-136.

7.                  Johnson, J. and Qu, J., 2006, "Three-dimensional numerical simulation tools for fracture analysis in planar Solid Oxide Fuel Cells (SOFCs)," Ceramic Engineering and Science Proceedings, v 27, n 4, Advances in Solid Oxide Fuel Cells II - A Collection of Papers Presented at the 30th International Conference on Advanced Ceramics and Composites, p.393-405.

8.                  Luangvilai, K., Jacobs, L.J. and Qu, J., 2006, "An improved technique for modal decomposition of a double-mode Lamb wave signal," Proceedings of SPIE - The International Society for Optical Engineering, v 6176, Nondestructive Evaluation and Health Monitoring of Aerospace Materials, Composites, and Civil Infrastructure V, 2006, p. 61760L.

9.                  Qu, J., 2006, "Adhesion and Fracture of Polymer-Metal Interfaces," Proceedings of EuroSime 2006, Como, Italy, April 24 – 24, 2006.

10.              Ferguson, T.P., Qu, J., 2006, "Predictive Model for Adhesion Loss of Molding Compounds from Exposure to Humid Environments," 2006 Proceedings, 56th Electronic Components & Technology Conference (IEEE Cat. No. 06CH37766C), 2006, p. 7 pp.

11.              Dingreville, R., Qu, J., 2006, "Modeling and characterization of the mechanical behavior of nano-sized structural elements," 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfa (IEEE Cat. No. 06TH8875), 2006, p 1 pp.

12.              Ferguson, T.P., Qu, J., 2005, "An engineering model for moisture degradation of polymer/metal interfacial fracture toughness," 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No. 05TH8808), 2005, p 298-301.

13.              Ferguson, T. P. and Qu, J., 2005 "An engineering model for moisture degradation of polymer/metal interfacial fracture toughness," Proceedings - 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, p 298-301 (Best Paper Award).

14.              Johnson, J. and Qu, J., 2005 "A numerical simulation tool for fracture analysis in solid oxide fuel cells," Ceramic Engineering and Science Proceedings, v 26, n 4, Advances in Solid Oxide Fuel Cells. A Collection of Papers Presented at the 29th International Conference on Advanced Ceramics and Composites, 2005, p 307-314.

15.              Liu, W. and Qu, J., 2005 "Creep deformation of Ni/YSZ cermet in SOFCs," Ceramic Engineering and Science Proceedings, v 26, n 4, Advances in Solid Oxide Fuel Cells. A Collection of Papers Presented at the 29th International Conference on Advanced Ceramics and Composites, 2005, p. 299-306.

16.              Luangvilai, K., L. J. Jacobs and Qu, J., 2005, "Modal decomposition of double-mode Lamb waves: numerical verification and discussion on extension to general multimode leaky Lamb waves." Proceedings of the SPIE - The International Society for Optical Engineering 5768(1): 304-12.

17.              Luangvilai, K., Jacobs, L.J., Wilcox, P.D., Lowe, M.J.S., Qu, J., 2005, "Broadband Attenuation Measurement for an Absorbing Plate," AIP Conference Proceedings, n 760, 2005, p 297-304.

18.              Pei, M. and J. Qu (2005), "Constitutive modeling of lead-free solders," Proceedings - 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, p 45-49.

19.              Su, B. and Qu, J., 2005, "Effect of filler geometry on the conduction of isotropically conductive adhesives," Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging, 2006, pp. 1889-1901.

20.              Su, B. and Qu, J., 2005, "Electrical contact resistance of silver with different coatings," Proceedings 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, pp. 75-78.

21.              Su, B. and Qu, J., 2004, "A Micromechanics Model for Electrical Conduction in Isotropically Conductive Adhesives during Curing", Proceedings – Electronic Components and Technology Conference, pp. 1766-1771.

22.              Junge, M., Jacobs, L.J., Qu, J., Jarzynski, J., La Saponara, V., 2004, "The Measurement of Applied Stresses Using the Polarization of Rayleigh Surface Waves," AIP Conference Proceedings, n 700, pt.2, 2004, p 1187-91.

23.              Ferguson, T.P. and Qu, J., 2004, "Moisture and Temperature Effects on the Reliability of Interfacial Adhesion of a Polymer/Metal Interface", Proceedings - Electronic Components and Technology Conference, pp. 1752-1758.

24.              Sun, Y., Zhang, R., Ma, J., and Qu, J., 2004, "A Microscopic Mechanics Model of Crack Growth with Fatigue-Creep Interaction," Proceedings of the 21st Int. Congress of Theoretical and Applied Mechanics, Warsaw, Poland, August 15-21.

25.              Dingreville, R., Qu, J. and Cherkaoui, M., 2004,"Effective elastic modulus of nano-particles," Proceedings - 9th International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, Vol. 9, p 187-192.

26.              Fan, L., Su, B., Qu, J., Wong, C.P. , 2004, "Effects of nano-sized particles on electrical and thermal conductivities of polymer composites," Proceedings - 9th International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, Vol. 9, p. 193 – 199.

27.              Su, B. and Qu, J., 2004, "A Micromechanics Model for Electrical Conduction in Isotropically Conductive Adhesives During Curing," 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, pt. 2, p 1766-71 Vol.2.

28.              Su, B. and Qu, J., 2004, "A Micromechanics Model for Electrical Conduction in Isotropically Conductive Adhesives During Curing," Proceedings - 9th International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, Vol. 9, p. 145-151.

29.              Luangvilai, K., Jacobs, L.J., Qu, J., 2004, "Far-Field Decay of Laser-Generated, Axisymmetric Lamb Waves," AIP Conference Proceedings, n 700, pt.1, 2004, p 158-64.

30.              Luangvilai, K., Jacobs, L.J., Wilcox, P., Lowe, M., Qu, J., 2007, "Characterization of lamb waves in absorbing plates," Proceedings of SPIE - The International Society for Optical Engineering, v 5394, Health Monitoring and Smart Nondestructive Evaluation of Structural and Biological Systems III, 2004, p 33-41.

31.              Dingreville, R. , Qu, J., Cherkaoui, M., 2004, "Effective Elastic Modulus of Nano-Particles," 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742), 2004, p 187-92.

32.              Ferguson, T.P, Qu, J., 2003, "Effect of moisture on the elastic modulus and interfacial adhesion of polymer-metal components in microelectronic assemblies, ASME EEP, Vol. 3, p.357-361.

33.              J. Kang, J. Qu, A. Saxena and L. Jacobs, 2003, "On the Detection of Creep Damage in a Directionally Solidified Nickel Base Superalloy Using Nonlinear Ultrasound," Review of Progress in Quantitative NDE, Vol. 23, pp.1248 – 1255.

34.              M. Junge, L. Jacobs, J. Qu, J. Jarzynski, and V. Saponara, 2003, "Measurement of Applied Stress Using the Polarization of Rayleigh Surface Waves," Review of Progress in Quantitative NDE, Vol. 23, pp.1187 – 1190.

35.              K. Luangvilai, L. Jacobs, and J. Qu, 2003, "Far-Field Decay of Laser-Generated, Axisymmetric Lamb Waves," Review of Progress in Quantitative NDE, Vol. 23, pp.158 – 164.

36.              K. Luangvilai, L. Jacobs, and J. Qu, 2003, "Propagation of Guided Lamb Waves in Concrete Repaired with Composite Plates," Proceedings of SPIE - The International Society for Optical Engineering, v 5057, 2003, p 85-90.

37.              Matthias, M., Jacobs, L., and Qu, J., 2002, "Nonlinear Wave Propagation in Silicon Rubber Using Bifrequency Signals and Laser Detection, AIP Conference Proceedings, n 615B, 2002, p 1369-76.

38.              S. K. Bhattacharya, S. K. Sitaraman, I. C. Ume, J. Qu, C. P. Wong, D. F. Baldwin, R. R. Tummala, 2001, “Large Area processing Using Small Area Substrates: a Low-Cost MCM-D Thin Film Processing,” Proceedings of INTERPACK’01, The Pacific/RIM ASME, International Electronics Packaging, Technical conference and Exhibition, July 8-13,  Kauai, USA.

39.              Ferguson, T.P. and Qu, J., 2001, "Moisture Absorption in No-Flow Underfill Materials and Its Effect on Interfacial Adhesion to Solder Mask Coated FR4 Printed Wiring Board," Proceedings of International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562), p. 327-32.

40.              Meurer, T., Qu, J., and Jacobs, L. J., 2001, “One-Dimensional Pulse Propagation in a Nonlinear Elastic Medium,” Advanced Nondestructive Evaluation for Structural and Biaological Health Monitoring, ed. Kundu, T., SPIE Vol. 4335, pp., 202-219.

41.              Meurer, T. ,Jacobs, L.J., Qu, J., 2001, "Application of Nonlinear Ultrasonic Waves to Characterize Hysteretic Materials," AIP Conference Proceedings, n 557B, 2001, p 1242-7.

42.              Niethammer, M., Eisenhardt, C., Jacobs, L.J., Jarzynski, J. and Qu, J., 2000, “Application of the Short Time Fourier Transform to Interpret Ultrasonic Signals,” Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 19A, pp. 703-708.

43.              Schubert, A., Dudek, R., Leutenbauer, R., Doring, R. Kloeser, J., Oppermann, H., Michel, B., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P., and Tummala, R., 2000, "Numerical and Experimental Investigation of Large IC Flip Chip Attach," Proceeding of 50th Electronic Components and Technology Conference, Las Vegas, Nevada, May 21-24.

44.              Eisenhardt, C., Jacobs, L.J., and Qu, J., 2000 “Experimental Lamb Wave Spectra of Cracked Plates, Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 19A, pp. 343-349.

45.              Valle, C., Qu, J., and Jacobs, L., 2000, “Scattering of Circumferential Waves in a Cracked Annulus,” Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 19A, pp. 217-224.

46.              Rao, Y., Qu, J., Wong, C.P. and Marinis, T., 2000, “Self-Consistent Model for Dielectric Constants Prediction of Polymer-Ceramic Composites,” IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials.

47.              Shi, S.H., Yao, Q., Qu, J. and Wong, C.P., 2000, “Study on the Correlation of Flip-Chip Reliability with Mechanical Properties of No-Flow Underfill Materials, IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, pp. 271-277.

48.