Refereed Publications

  1.     Achenbach, J.D. and Qu, J., "Resonant Vibration of Submerged Beam," J. Sound and Vibration, 105, p.185-195, 1986.

  2.     Roberts, R.A., Qu, J. and Achenbach, J.D., "Experimental and Theoretical Analysis of Backscattering Mechanism in Fiber-Reinforced Composites," in Acousto-Ultrasonic: Theory and Application, ed. by J. C. Duke, Plenum Press, pp. 151-164, 1988.

  3.     Bassani, J.L. and Qu, J., "Finite Crack on Bimaterial and Bicrystal Interfaces," J. Mech. Phys. Solids, 37, p.435-453, 1989.

  4.     Bassani, J.L. and Qu, J., "On Elasticity Solutions for Cracks on Bimaterial and Bicrystal Interfaces," Materials Science and Eng., A107, p.177-184, 1989.

  5.     Qu, J., "Discussion of General Solutions of a Central Crack in a Strip Sandwiched Between Two Different Outer Layers," Engineering Fracture Mechanics, 32, p.163-165, 1989.

  6.     Qu, J., Achenbach, J.D. and Roberts, R.A., "Reciprocal Relations for Transmission Coefficients: Theory and Application," IEEE Trans., Ultrasonics, Ferroelectrics and Frequency Control, 36(2), p.280-286, 1989.

  7.     Qu, J., and Bassani, J.L., "Cracks on Bimaterial and Bicrystal Interfaces," J. Mech. Phys. Solids, 37, p.417-433, 1989.

  8.     Qu, J. and Li, Q.Q., "Interfacial Dislocation and Its Application to Interface Cracks in Anisotropic Bimaterials," J. Elasticity, 26, p.169 - 195, 1991.

  9.     Qu, J., "Green's Function in Anisotropic Bimaterials," in Modern Theory of Anisotropic Elasticity and Applications, ed. by J.J Wu, T.C.T. Ting and D.M. Barnett, p. 62 - 73, 1992.

  10.     Bassani, J.L., and Qu, J., "Fracture Parameters for Interface Cracks," ASTM, Special Technical Publication, 1131, p.549 - 559, 1992.

  11.     Qu, J., Bassani, J.L., and Li, Q.Q., "Interfacial Dislocation in Anisotropic Bimaterials," ASTM, Special Technical Publication, 1131, p.578 - 589, 1992.

  12.     Qu, J. and Bassani, J.L., "Fracture Mechanics of Interface Cracks in Anisotropic Materials," J. Appl. Mech., 60, p.422 - 431, 1993.

  13. .    Qu, J., "Eshelby Tensor for an Elastic Inclusion with Slightly Weakened Interface," J. Appl. Mech., 60, p.1048 - 1050, 1993.

  14. .    Yang, L. and Qu, J., "Fracture Mechanics Parameters for Cracks on Slightly Undulating Interfaces," Int. J. Fracture, 64, p.79-91, 1993.

  15. .    Qu, J., "Effects of Slightly Weakened Interfaces on the Overall Elastic Properties of Composite Materials," Mechanics of Materials, 14, p.269 - 281, 1993.

  16. .    Qu, J., "Interface Crack Loaded by Time Harmonic Plane Waves," Int. J. Solids & Structures, Vol. 31, p. 329 - 345, 1994.

  17. .    Qu, J., "Scattering of Plane Waves from an Interface Crack," Int. J. Engineering Science, Vol. 33, p.179-194, 1995.

  18. .    Littles, J., Jacobs, L. and Qu, J., "Experimental and Theoretical Investigation of Scattering from a Distribution of Cracks," Ultrasonics, Vol. 33, p.37-43, 1995.

  19. .    Veazie, D.R. and Qu, J., "Effects of Interphases on the Transverse Stress-Strain Behavior in Unidirectional Fiber Reinforced Metal Matrix Composites," Composite Engineering, Vol. 5, p. 597-610, 1995.

  20. .    Veazie, D.R. and Qu, J., "Effects of Interphases on the Transverse Stress-Strain Behavior of Fiber Reinforced Metal Matrix Composites," ACTA Mechanica Solida Sinica, Vol. 8, p.625-628, 1995.

  21. .    Yang, L. and Qu, J., "Energy Release Rate For Cracks On A Non-Planer Interface," Key Engineering Materials, Vol. 120-121, Fracture of Composites, ed. E. Armanios, p.47-62, 1996.

  22. .    Liu, G. and Qu, J., "Guided Circumferential Waves in a Circular Annulus," J. Appl. Mech., Vol. 65, p.424-430, 1998.

  23. .    Liu, G. and Qu, J., "Transient Wave Propagation in a Circular Annulus Subjected To Impulse Excitation on Its Outer Surface," J. Acost. Soc. Am., Vol. 103, p.1210-1220, 1998.

  24. .    Qu, J. and Hoiseth, K., "Evolution of Transverse Matrix Cracking In Cross-Ply Laminates," Int. J. Fatigue & Fracture Eng. Materials & Structures, Vol. 21, p.451-464, 1998.

  25. .    Bulsara, V.N., Talreja R. and Qu, J., "Damage Initiation under Transverse Loading of Unidirectional Composite with Arbitrarily Distributed Fibers," Composite Science & Technology, Vol. 59, p.673-682, 1999.

  26. .    Olliff, D., Qu, J., Gaynes, M., Kodnani, R., and Zubelewicz, A., "Characterizing the Failure Envelope of a Conductive Adhesive," J. Electronic Packaging, Vol. 121, p.23-30, 1999.

  27. .    Moser, F., Jacobs, L.J. and Qu, J, "Application of Finite Element Methods to Study Wave Propagation in Wave Guides," NDT & E Int., Vol. 32, pp 225-234, 1999.

  28. .    Qu, J. and Xue, Y., "Three-Dimensional Interface Cracks in Anisotropic Bimaterials - The Non-Oscillatory Case," J. Appl. Mech., Vol. 65, pp.1048 - 1055, 1999.

  29. .    Xue, Y. and Qu, J., "Elliptical Interface Cracks in Anisotropic Bimaterials," Mixed Mode Crack Behavior, ASTM, STP 1359, K. J. Miller and D. L. McDowell, Eds, American Society for Testing and Materials, West Conshohocken, PA, pp. 143 – 159, 1999.

  30. .    Valle, C., Qu, J. and Jacobs, L. J., "Guided Circumferential Waves In Layered Cylinders," Int. J. Eng. Science, Vol. 37, pp.1369 – 1387, 1999.

  31. .    Yao, Q. and Qu, J., "Three-Dimensional vs. Two-Dimensional Finite Element Modeling of Flip Chip Packages," J. Electronic Packaging, Vol. 121, pp.196 – 201, 1999.

  32. .    Qu, J., Berthelot, Y. and Jacobs, L., "Crack Detection in Thick Annular Components Using Ultrasonic Guided Waves," J. Mech. Eng. Sci., accepted for publication.

  33. .    Kley, M., Valle, C., Jacobs, L. J., Qu, J. and Jarzynski, J., Development of Dispersion Curves for Two-Layered Cylinders Using Laser Ultrasonics," J. Acost. Soc. Am., Vol. 106, pp. 582 - 588, 1999.

  34. .    Davis, J. E. and Qu, J., "Numerical Analysis of Fiber Fragmentation in a SiC/Al Single Fiber Composite Specimen," J. Composites Science and Technology, in press.

  35. .    Kuhl, A. and Qu, J., "A Technique to Measure Interfacial Toughness over a Range of Phase Angles," J. Electronic Packaging, accepted for publication.

  36. .    Eisenhardt C., Jacobs, J.J., and Qu, J., "Application of Laser Ultrasonics to Develop Dispersion Curves for Elastic Plates," J. Appl. Mech., Vol. 66, No., pp. 1043-1045, 1999.

  37. .    Niethammer, M, Jacobs, L., Qu, J., and Jarzynski, J, "Time-Frequency Representation of Lamb Waves Using the Reassigned Spectrogram, " J. Acoust. Soc. Am., Vol. 107, L19-L24, 2000.

  38. .    Yao, Q., Qu, J., Wu, J., and Wong, C.P., "Characterization of Underfill/Substrate Interfacial Toughness Enhancement by Silane Additives," IEEE Trans. on Electronic Packaging Manufacturing, Vol. 22, 1999.

  39. .    Schubert, A., Dudek, R., Leutenbauer, R, Doring, R., Kloeser, J., Oppermann, Michel, B., H., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P. and Tummala, R., "Does Chip Size Limits Exist for DCA?" IEEE Trans. on Electronic Packaging Manufacturing, Vol. 22, 1999.

  40. .    S. Bhattacharya, S., Gardner, B., Qu, J., Baldwin, D. and Tummala, R., "Low-cost large area processing using small area substrates - A Novel Multi-tiled Palletization Concept for MCM-D Thin Film Process," IEEE Transactions on Advanced Packaging, accepted for publication.

  41. .    Heller, K., Jacobs, L.J. and Qu, J., "Characterization of Adhesive Bond Properties Using Lamb Waves, " NDT & E Int., submitted.

  42. .    Valle, C., Niethammer, M., Qu, J. and Jacobs, L.J., "Crack Characterization using Guided Circumferential Waves," Journal of the Acoustical Society of America, submitted 2000.

  43. .    Niethammer, M., Jacobs, L.J., Qu, J., and Jarzynski, J., "Time-Frequency Representation of Lamb Waves," J. Acous. Soc. Ame., submitted, 2000.

  44. .    Eisenhardt, C., Valle, C., Niethammer, M., Jacobs, L.J. and Qu, J. "Effect of crack length on Laser-generated and detected Lamb waves," Journal of Nondestructive Evaluation, submitted, 2000.

  45. .    Valle, C., Niethammer, M., Qu, J. and Jacobs, L., "Crack Characterization Using Guided Circumferential Waves," J. Acous. Soc. Ame., submitted, 2000.

 

 

Other Publications

  1. Achenbach, J.D. and Qu, J., "Backscattering from Flaw Distribution in Composite Materials," Review of Progress in Quantitative NDE, 5B, p.1179 - 1187, 1985.

  2. Qu, J. and Achenbach, J.D., "Analytical Treatment of Polar Backscattering from Porous Composites,"Review of Progress in Quantitative NDE, 6B, p.1137 - 1146, 1986.

  3. Qu, J. and Achenbach, J.D., "Backscattering from Porosity in Cross-Ply Composites,"Review of Progress in Quantitative NDE, 7, p.1029 - 1036, 1987.

  4. Qu, J. and Achenbach, J.D. and Roberts, R.A., "Backscattering from Porosity in Fiber-Reinforced Composites," Mechanics of Composite Materials, ed. By G. J. Dvorak and N. Laws, ASME, AMD-Vol. 92, p.69 - 77, 1988.

  5. Qu, J., "Elastic Wave Scattering by Macro-Micro Crack Configurations," Review of Progress in Quantitative NDE, 8, p.79 - 86, 1988.

  6. Bassani, J.L. and Qu, J., "Interfacial Discontinuities and Average Bimaterial Properties," Acta/Scripta Metallurgica Proceedings Series, 4, pp. 401-406, 1989.

  7. Qu, J. and Bassani, J.L., "Interface Cracks Between Anisotropic Elastic Solids," Acta/Scripta Metallurgica Proceedings Series, 4, pp. 407-412, 1989.

  8. Qu, J., "Low Frequency Scattering by a Planar Crack," Review of Progress in Quantitative NDE, 9, p.61-68, 1990.

  9. Qu, J., "Wave Scattering by an Inclusion with Imperfect Interface with the Matrix," Review of Progress in Quantitative NDE, 10, p.1281 - 1288, 1991.

  10. Qu, J. and Yang, L., "Interaction of Dislocations in Anisotropic Bimaterials, " Recent Development in Elasticity, AMD, 124, p.13 - 21, 1991.

  11. Qu, J., "Reflection and Scattering by a Slightly Undulating Interface," Review of Progress in Quantitative NDE, 11, p.41 - 48, 1992.

  12. Qu, J., "Wave Reflection at a Slightly Undulating Interface," ASME, NCA, 14, Vibro-Acoustic Characterization of Materials and Structures, p. 73 - 77, 1992.

  13. Jacobs, L. and Qu, J., "Reflection and Scattering by a Traction-Free Surface with Small Defects," Review of Progress in Quantitative NDE, 11, p.1609 - 1614, 1992.

  14. Qu, J. "Characterization of Interfaces From Ultrasonic Data," ASME, NCA-14/AMD-172, Dynamic Characterization of Advanced Materials, p.107 - 116, 1993.

  15. Qu, J. "Scattering of Elastic Waves by an Interface Crack," ASME, NCA-14/AMD-172, Dynamic Characterization of Advanced Materials, p.201 - 214, 1993.

  16. Qu, J., "Effects of Roughness on the Reflection Coefficient," Review of Progress in Quantitative NDE, 12, p.1783 - 1790, 1993.

  17. Qu, J., "Reflection of Elastic Waves by an Array of Interface Cracks," Review of Progress in Quantitative NDE, 12, p.99 - 106, 1993.

  18. Jacobs, L. and Qu, J., "Nondestructive Characterization of Damaged Bonds," Review of Progress in Quantitative NDE, 12, p.1587 - 1594, 1993.

  19. Qu, J., "Guided Waves in an Anisotropic Layer Sandwiched Between Anisotropic Solids," Review of Progress in Quantitative NDE, Vol. 13, p.1391-1398, 1994.

  20. Qu, J., "Scattering of Elastic Waves by Interface Cracks," Review of Progress in Quantitative NDE, Vol. 13, p.53-60, 1994.

  21. Littles, J., Jacobs, L. and Qu, J., "Laser Interferometric Investigation of Scattering from A Distribution of Cracks," Review of Progress in Quantitative NDE, Vol. 13, p.61-68, 1994.

  22. Qu, J. "Reflection of Elastic Waves By a Randomly Cracked Interface," ASME, AMD-177, Ultrasonic Characterization and Mechanics of Interfaces, 1993.

  23. Shepherd, R., Qu, J., and Wu, Tien, "Process-Induced Residual Stresses in a Glob Top Encapsulated Silicon Chip," Application of Fracture Mechanics in Electronic Packaging and Materials, ASME, EEP-Vol. 11, p.109-122, 1995.

  24. Qu, J., Berthelot, Y., and Li, Z., "Dispersion of Guided Circumferential Waves in a Circular Annulus," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 15A, p. 169-176, 1996.

  25. LeGall, C., McDowell and Qu, J., "Delamination Cracking in Encapsulated Flip Chips," Proceeding of 46th ECTC, p.430-443, 1996.

  26. Qu, J. and Hoiseth, K., "Evolution of Transverse matrix Cracking in Cross-Ply Laminates," Progress in Advanced Materials and Mechanics, ed. by T. Wang and T.W. Chou, Peking University Press, p.1207, 1996.

  27. Bulsara, V.N., Telreja, R. and Qu, J., "Using Spatial Descriptors To Identify Damage Initiation In Nicalon/MAS-5," Proceedings of the 11th Technical Conference On Composites, ASC, p. 10, 1996.

  28. LeGall, C. A., Qu, J., and McDowell, D. L., "Influence Of Die Size On The Magnitude Of Thermomechanical Stresses In Flip Chips Directly Attached To Printed Wiring Board," Advances in Electronic Packaging, EEP-Vol. 19-2, p. 1663-1670, 1997.

  29. LeGall, C. A, Qu, J., and McDowell, "Thermomechanical Stresses in an Underfilled Flip Chip DCA," Proceeding of 3rd Int. Symposium on Advanced Packaging Materials, March 9-12, Braselton GA, p.128-129, 1997.

  30. Wong, C.P., Tummala, R., Qu, J., and Sitaraman, S., "Microelectronic Packaging Trends - Role of Reliability in Particularly Related to Solder Joints Reliability," in Design and Reliability of Solders and Solder Interconnections, ed. By R.K. Mahidhara, D.R., Frear, S.M.L. Sastry, K.L. Murty, P.K. Liaw and W.L. Winterbottom, The Minerals, Metals and Materials Society, p. 3-8, 1997.

  31. Moser, F., Valle, C., Jacobs, L.J., and Qu, J., "Application of Finite Element Methods to Study Transient Wave Propagation in Elastic Wave Guides," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 16A, p.161-167, 1998.

  32. Liu, G. and Qu, J., "Guided Transient Waves in a Circular Annulus," Review of Progress in Quantitative NDE, Vol. 16A, p.153-160, 1998.

  33. Qu, J. and Liu, G., "Effect of Residual Stress on Guided Waves in Layered Media," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 16B, p.1635-1642, 1998.

  34. LeGall, C. A, Qu, J., and McDowell, "Some Mechanics Issues Related To The Thermomechanical Reliability Of Flip Chip DCA With Underfill Encapsulation, "ASME, EEP-Vol. 222, p.85-95, 1997.

  35. McDowell, D.L., Neu, R.W., Qu, J. and Saxena, A., "Prognostic Tools for Small Cracks in Structures," Emerging Technologies for Machinery Health Monitoring and Prognosis, ASME, TRIB-Vol. 7, p. 1-12, 1997.

  36. Qu, J. and Wong, C.P., "Effective Thermomechanical Properties of Underfill Materials for Flip-Chip Packaging Applications," Proceeding of 48th ECTC, p.848-850, 1998.

  37. Yao, Q. and Qu, J., Finite Element Modeling and Deflection of Flip-Chip Package under Thermal Loading," ASME MED-Vol. 8, pp.779-787, 1998.

  38. Wong, C.P., Rao, Y., Qu, J., and Wu, Sean, "Creep Behavior Characterization of Some New Materials for High Density Interconnect Substrates Using Dynamic Mechanical Analyzer," Proceeding of 4rd Int. Symposium on Advanced Packaging Materials, March 15-18, Braselton GA, p.73-76, 1998.

  39. Veazie, D. R., Lindsay, J. and Qu, J., "Characterizing Adhesive Joints Using An Interfacial Fracture Mechanics Approach," Proceedings of the SEM Spring Conference on Experimental and Applied Mechanics, Houston, TX, June 1 - 3, 1998.

  40. Veazie, D. Qu, J. and Lindsay, J., "Effects of Elevated Temperature Aging on the Fracture Toughness of Adhesive Joints," Proceeding of the Eighth Japan - US Conference on Composite Materials, Baltimore, Maryland, Sept 24-25, 1998.

  41. Bulsara, V. N., Talreja, R. and Qu, J., "Damage in Ceramic Matrix Composites with Arbitrary Microstructures", in Composites and Functionally Graded Materials, MD-Vol. 80, T. S. Srivatsan, et al., Eds., American Society of Mechanical Engineers, 1997, pp. 441-446.

  42. Kuhl, A.M. and Qu, J., "A Technique to Measure Interfacial Fracture Toughness," Proceedings of the 21st Annual Meeting of the Adhesion Society, p.105-107, 1998.

  43. Kely, M., Jacobs, L., Valle, C., Qu, J., and Jarzynski, J, "Development of Dispersion Relationship for layered Cylinders Using Laser Ultrasonics," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 18A, pp.263-268, 1999.

  44. Liu, G., Qu, J., Jacobs, L., and Li, J., "Characterizing The Curing of Adhesive Joints by a Nonlinear Ultrasonic Technique," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 18B, p2191-2199, 1999.

  45. Valle, C., Qu, J., and Jacobs, L., "On The Dispersion And Displacement Distribution of Circumferential Waves In a Composite Circular Cylinder," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, Vol. 18A, pp.247-254, 1999.

  46. Qu, J. and Yao, M., "Three Dimensional Finite Element Modeling of Flip Chip Packages under Thermal Loading," Proceedings of the 3rd Int. Symposium on Electronic Packaging Technology, pp. 271-275, 1998.

  47. Qu, J. and Kuhl, A., "Interfacial Fracture Toughness between Cu and Several Underfill Materials," Proceedings of the 3rd Int. Symposium on Electronic Packaging Technology, pp.276-280, 1998.

  48. Yao, Q. and Qu, J., "Effects of PWB Size on The Warpage of Flip Chip Assemblies," ASME, EEP-Vol. 26-1, Advances in Electronic Packaging, pp.27 – 31, 1999.

  49. Yao, M., Qu, J., and Wu, S., "Thermomechanical Fatigue Life of Chip Scale Packages," ASME, EEP-Vol. 26-2, Advances in Electronic Packaging, pp.1533 – 1538, 1999.

  50. Yao, Q., Qu, J. Wu, J., and Wong, C.P., "Adhesion Enhancement of Underfill Materials by Silane Additives," IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, p.27-30, 1999.

  51. Schubert, A., Dudek, R., Leutenbauer, R., Doring, R. Kloeser, J., Oppermann, H., Michel, B., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P., and Tummala, R., "Do Chip Size Limits Exist for DCA?" IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, pp.150-157, 1999.

  52. Rao, Y., Wong, C.P., and, Qu, J., "Electrical and Mechanical Modeling of Embedded Capacitors" IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, p.158-162, 1999.

  53. Yao, Q., and Qu, J., "Effect of Thermal Residual Stresses on the Apparent Interfacial Toughness of Epoxy/Aluminum Interface," IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, p.333-336, 1999.

  54. Liu, G. and Qu, J., "Characterizing Adhesive Curing by Nonlinear Ultrasonic Techniques," Proceeding of the 2nd Japan-US Symposium on Advances in NDT, pp.52-58, June 21-25, 1999.

  55. Yao, M., Qu, J., and Wu, S., "Estimate the Thermomechanical Fatigue Life of a Flip Chip DCA," Proceeding of 49th Electronic Components and Technology Conference, pp.797-802, San Diego, CA. June 1-4, 1999.

  56. Yao, M., Qu, J., Wu, J., and Wong, C.P., "Effect of Thermal Residual Stresses on the Apparent Polymer/Metal Interfacial Toughness," Proceeding of 49th Electronic Components and Technology Conference, pp.365-368, San Diego, CA. June 1-4, 1999.

  57. Yao, M., Qu, J., Wu, J., and Wong, C.P., "Quantitative Characterization of Interfacial Toughness Enhancement by Silane Additives," Proceeding of 49th Electronic Components and Technology Conference, pp.1079-1082, San Diego, CA. June 1-4, 1999.

  58. Yang, Wong, C.P., and Qu, J., "Electric and Mechanical Modeling of Embedded Capacitors," Proceeding of 49th Electronic Components and Technology Conference, pp.506 – 509, San Diego, CA. June 1-4, 1999.

  59. Qu, J. and Xue, Y., "Three-Dimensional Interface Cracks in Anisotropic Bimaterials," Proceeding of the 6th Annual International Conference on Composite Engineering, pp. 671 – 672, Orlando, FL., June 24 – July 3, 1999.

  60. Niethammer, M., Eisenhardt, C., Jacobs, L.J., Jarzynski, J. and Qu, J., "Application of the Short Time Fourier Transform to Interpret Ultrasonic Signals," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, to appear.

  61. Eisenhardt, C., Jacobs, L.J., and Qu, J., "Experimental Lamb Wave Spectra of Cracked Plates, Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, to appear.

  62. Valle, C., Qu, J., and Jacobs, L., "Scattering of Circumferential Waves in a Cracked Annulus," Review of Progress in Quantitative NDE, Review of Progress in Quantitative NDE, to appear.

  63. Yao, Q. and Qu, J., "Solder Fatigue Life in Two Chip Scale Packages," Proceedings of IEEE-IMAPS International Symposium on Microelectronics, pp. 563 – 570, Chicago, IL., October 25 – 28, 1999.

  64. Yao, Q. and Qu, J., "Effects of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion," ASME MD-Vol. 88, pp.25-28, 1999.

  65. Rao, Y., Qu, J., Wong, C.P. and Marinis, T., "Self-Consistent Model for Dielectric Constants Prediction of Polymer-Ceramic Composites," IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, 2000.

  66. Shi, S.H., Yao, Q., Qu, J. and Wong, C.P., "Study on the Correlation of Flip-Chip Reliability with Mechanical Properties of No-Flow Underfill Materials, IMAPS/IEEE, Proceeding of 5rd Int. Symposium on Advanced Packaging Materials, 2000.

  67. Schubert, A., Dudek, R., Leutenbauer, R., Doring, R. Kloeser, J., Oppermann, H., Michel, B., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P., and Tummala, R., "Numerical and Experimental Investigation of Large IC Flip Chip Attach," Proceeding of 50th Electronic Components and Technology Conference, Las Vegas, Nevada, May 21-24, 2000.

  68. Rao, Y., Wong, C.P., Qu, J. and Marinis, T., "Effective Dielectric Constant Prediction of Polymer-Ceramic Composite Based on Self-Consistent Theory," Proceeding of 50th Electronic Components and Technology Conference, Las Vegas, Nevada, May 21-24, 2000.