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ME 6776: Integrated Low-Cost Microelectronics Systems Packaging
Offered Every Fall
| Credit Hours: |
3-0-3 |
| Prerequisites: |
Graduate standing in engineering or a related discipline. |
| Catalog Description: |
Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package. Crosslisted with ECE and MSE 6776. |
| Textbooks: |
Rao Tummala, Fundamentals of Microsystems Packaging, 1st Edition, McGraw Hill, 2001. |
| Instructors: |
Rao Tummala (ECE - Fall 2004) |
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