Ph.D. Proposal Presentation by
Friday, November 18, 2005
(Dr. Suresh K. Sitaraman , Chair)
" Development of a Knowledge Model for the Computer-Aided Design of Electronic Packaging Systems for Reliability "
Most systems are designed to perform required functions under stated conditions for a stated period of time. Such a concept of reliability is an important factor in competitive system development. Therefore, it is advantageous to predict, analyze, and enhance system reliability at the design stage. However, designing complex systems that satisfy a target reliability is a challenge because of the complex assembly structure and logical connections, numerous components and associated failure modes, and limited reliability data or prediction models.
To overcome these difficulties and design complex systems in a systematic way, this research proposes a formal method for computer-aided system design for reliability (SDfR) with a focus on microelectronic packaging systems. This system design for reliability approach includes three enabling methodologies and associated technologies: 1) a knowledge model that provides a formalism for SDfR, 2) a new framework for computer-aided reliability simulations that supports various reliability prediction models, and 3) a new communication protocol for SDfR information.
The proposed knowledge model, called Reliability Object Model (ROM), will consist of 1) a new failure analysis structure, 2) reliability metrics that represent the combined effects of random failures and wearout failures, 3) new algorithms that allocate and assess reliability, and 4) precise representation of SDfR elements for field usage conditions and design features. Based on this knowledge model, a framework for computer-aided reliability simulations and a communication protocol are constructed. The proposed knowledge model will be implemented in a prototype tool and will be validated through microelectronic packaging system examples and test vehicles.