M.S. Thesis Presentation by Andrew Joseph Scholand
Friday, September 28, 2001

(Dr. Robert Fulton, advisor)

"Analysis-Enhanced Electronic Assembly"


In general, analysis has only been used in the Electronic Assembly and Fabrication domain either to improve manufacturing yields through process simulation or to troubleshoot a product-process interaction problem. Other difficulties include knowledge of and access to suitable analysis models for decision support, addressing the dynamic nature of the productâ€ôs transformation from raw materials to finished product, and sparse relationships between analysis boundary conditions and manufacturing resources. The use of analyses in the manufacturing environment would also benefit from explicit representation of which manufacturing processes were represented in a given analysis, and how their effect upon the product was accounted for.

This research aims to improve manufacturing processes used in Electronics Assembly by developing a novel application for analysis in this domain. By taking advantage of the structured nature of manufacturing in the Electronics Assembly arena, an explicit quantification of the effect of process management on various measures of product quality is enabled. Thus, the manufacturing engineer utilizing this new Analysis-Enhanced Electronic Assembly representation can measure, and hence trade-off, the effects of process management on both the quality of goods produced and the manner in which his company meets customer demand.

This research extends research undertaken by the Engineering Information Systems Lab over the last decade to improve the methodology of analysis. This prior work includes the information architecture used to unify disparate information sources needed for analysis, and a formalism for capturing the nature of and the usage of simplifications (idealizations) to this data. Key extensions included an Analyzable Manufacturing Model to capture equipment and process plan information needed by analysis, and a Topic Map based associativity meta layer above existing framework objects.

Deliverables include of this research include: (a) a new Analysis-Enhanced Electronic Assembly representation; (b) the identification, classification, and organization of several analysis modules in a prototype toolkit; and (c) example case studies showing the utility of this approach.