M.S. Thesis Presentation by Jordan Neysmith
Monday, November 13, 2000

(Dr. Danial Baldwin, advisor)

"The Integration of Solid Oxide Fuel Cell Technology into Industrial Power Generation Systems"

Abstract

"MEMS" is an acronym used to describe microscopic devices that incorporation both mechanical and electrical elements on a common substrate (Micro-Electro-Mechanical Systems). While MEMS fabrication technology has progressed rapidly during the past decade, little attention has been given to the packaging of MEMS devices. Packaging of MEMS devices is significantly more involved than standard IC packaging in that MEMS packaging solutions must support device release steps, post release processing and environmental interaction control in the addition to fulfilling the standard requirements of mechanical support, electrical interconnection, and thermal management. Nevertheless, MEMS packages should be small and inexpensive in order for the end product to be commercially viable.

The goal of this research project was to design a MEMS carrier suitable for low cost manufacturing. The need for such a carrier was apparent in the minimal presence of MEMS products in today's commercial market, despite the existence of numerous prototype MEMS devices. The project was structure so as to establish a solid foundation on which further MEMS packaging research could be based. Contributions were made in three areas: first, by designing a modular, direct-chip-attach, wafer-level MEMS package architecture; second, through the acquisition of processing knowledge for a broad range of advanced microfabrication techniques; and third, with testing of the package components in order to characterize their performance.