(Dr. Jianmin Qu, advisor)
"Thermomechanical Modeling of Fiber Reinforced Composite Materials for Base Substrate Applications in Microelectronic Systems"
The goal of this research is to develop tools to predict the material properties of any two phased hybrid composite so that materials can be developed that will reduce the internal stresses occurring in microelectronics due to thermo-elastic mismatch between the chip and base substrate material. Micromechanical and laminate plate theory models have been used to predict the Young’s modulus, coefficient of thermal expansion (CTE) and dielectric properties of two-phased fibrous composites of various woven and non-woven structures. These models consist of: