I. Charles Ume
Professor
Education
- Ph.D., University of South Carolina, 1985
- M.S., University of South Carolina, 1981
- B.S., University of North Carolina, Charlotte, 1979
Research Areas and Descriptors
Background
Dr. Ume began at Tech in 1985 as an Assistant Professor.
Research
Dr. Ume's research in the areas of automation, manufacturing and mechatronics involves the modeling of system behavior, and the development of intelligent machines for nondestructive evaluation of materials and for process monitoring and control. His major research thrusts are in the areas of electronic packaging and laser ultrasonics.
There are three ongoing research activities in the electronic packaging area including the thermomechanical reliability in electronic packaging; post solder reflow interconnect evaluation; and the reliability of plated-through-hole (PTHs). The first project involves both experimental evaluation (with laser moir technique) and finite element analysis of thermally induced warpage in a printed circuit board (PCB) or a computer chip. The second project involves an analysis and experimental evaluation of solder joint quality in PCB, using the laser ultrasonic technique. The third one is the study of failure modes of PTHs in a printed circuit board by using thermo-plasticity and thermo-viscoplasticity theories. The sponsors of this work are Motorola, Visteon, Ford, Wright Patterson Air Force Base, the Defense Advanced Research Projects Agency, MCM-D Consortium, Siemens, IBM, Army Aviation & Missile Command, Department of Energy (DOE), Intel, and the National Science Foundation (NSF).
Dr. Ume's work in laser ultrasonics involves the development of various laser array techniques for generating ultrasound in both room and high temperature environments. The second area involves the development of array models for predicting ultrasound propagation in high temperature solids and liquids, and the third focuses on the application of laser array technique for real-time weld quality monitoring and control, during robotic welding process. The fourth project in laser ultrasonics involves the study of how to use this technique for stress measurements. The receiving sensors include laser interferometer, PZT transducers, and electromagnetic acoustic transducers. This research is sponsored by NSF, Navy and DOE.
Dr. Ume has a track record of spinning off a successful commercial enterprise venture from his research project in the printed circuit board and chip warpage evaluations. He plans to ramp up his solder joint quality evaluation research, and his real-time weld quality monitoring and control research to the levels where they can be commercialized. The students who work in these research projects will play vital roles in transferring these technologies to industry.
Students will find out that Dr. Ume's research projects are at the cutting edge of technology, and that they are applied and multidisciplinary in nature. They can easily see how the results of their research will impact manufacturing and productivity all over the world.
Distinctions
- American Society of Mechanical Engineers
- Fellow, 2003
- Electronics and Photonic Packaging Division Program Chair, 2000-2001
- Journal of Electronic Packaging Best Paper of the Year Award, 1997
- Journal of Electronic Packaging Associate Editor, 1996-1999
- Georgia Institute of Technology
- Outstanding Interdisciplinary Award, 2002
- Advanced Technology Development Center Faculty Research Commercialization Award, 2000 and 2003
- Transactions on Components and Packaging Technologies Associate Technical Editor, 1999-present
- Institute of Electrical and Electronics Engineers
- Components, Packaging and Manufacturing Technology Society Sustained Technical Contribution Award, 2005
- Fellow, 2004
- Sigma Xi (Georgia Tech Chapter)
- Sustained Research Award, 2007
- Outstanding Ph.D. Thesis Award (Advisor to Terry Sanderson), 1998
- Best M.S. thesis (Advisor to Denigno Maqueira), 1987
- Instrumentation, Systems, and Automation Society
- Donald P. Eckman Education Award, 2002
- E. G. Bailey Award, 1999
- American Society for Engineering Education Robert G. Quinn Award, 2004
- American Society of Mechanical Engineers Fellow, 2003
- Nigerian National Order of Merit Award, 2003
- Journal of Mechatronics
- Co-Editor-in-Chief, 2001-present
- Regional Technical Editor, 1999-2001
- 7th Mechatronics Forum International Conference and Mechatronics Workshop General Chair, 2000
Patents
- Object Inspection Method and System, U. S. Patent 6,747,268, June 8, 2004.
- Method and Apparatus for Measuring Thermal Warpage Using Projection Moire, U. S. Patent 6,564,166, May 13, 2003
Representative Publications
- S. Liu and I. C. Ume. 2002. Vibration Analysis Based Modeling and Defect Recognition for Flip Chip Solder Joint Inspection. Journal of Electronic Packaging, 124, 221-226.
- Y. Polsky and C. Ume. 1999. Thermoelastic Modeling of a PWB with Simulated Circuit Traces Subjected to Infrared Reflow Soldering with Experimental Validation. Journal of Electronic Packaging 121(4), 263-270.
- T. Sanderson, I. C. Ume, and J. Jarzynski. 1998. Experimental and Numerical Results for Intensity Modulated Laser Ultrasonics. Journal of the Acoustical Society of America 10, 1-6.
- M. Stiteler and I. C. Ume. 1997. System for Real-Time Measurement of Thermally Induced Warpage in a Simulated Infrared Soldering Environment. Journal of Electronic Packaging 119, 1-7.
- J. Yang, T. Sanderson, and I. C. Ume. 1996. Laser Phased Array Measurement of Solidified Weld Penetration Depth. Journal of Manufacturing Science and Engineering 5(7), 266-271.
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