Samuel N. Heffington

Research Engineer II

Office:	Love, Room 215
Phone:	404.385.2142
Fax:	404.894.8496
E-mail:

Education

• Ph.D., Georgia Institute of Technology, 2001
• M.S., University of Texas at Austin, 1996
• B.S., Texas A&M University, 1994

Research Areas and Descriptors

• Heat Transfer and Fluid Mechanics; Thermal management of electronic packages, spray cooling, boiling enhancement, two-phase flows.

Representative Publications

• Heffington, S.N., W.Z. Black, and A. Glezer. 2002. Vibration-Induced Droplet Atomization Heat Transfer Cell for Burn-in of Microprocessors. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2002), San Diego, CA.
• Heffington, S.N., W.Z. Black, and A. Glezer. 2002. Vibration-Induced Droplet Atomization Heat Transfer Cell for High-Heat Flux Dissipation. Thermal Challenges in Next Generation Electronic Systems (THERMES-2002), Santa Fe, NM.
• Vukasinovic, B., S.N. Heffington, M.K. Smith, A. Glezer, 2001. Vibration-Induced Droplet Atomization (VIDA) for Two-Phase Thermal Management. Proceedings of the IMECE 2001: International Mechanical Engineering Congress and Exposition, New York, NY.
• Heffington, S.N., W.Z. Black, and A. Glezer. 2001. Vibration-Induced Droplet Atomization Heat Transfer Cell for Cooling of Microelectronic Components. The Pacific Rim/ASME International Electronic Packaging Technical Conference & Exhibition, Hawaii.
• Heffington, S.N., W.Z. Black, and A. Glezer. 2001. Vibration-Induced Droplet Atomization Heat Transfer Cell for Microelectronic Thermal Management. 13th European Microelectronics and Packaging Conference & Exhibition, Strasbourg, France.
• Heffington, S.N., W.Z. Black, and A. Glezer. 2000. Vibration-Induced Droplet Cooling of Microelectronic Components. ITHERM 2000 Proceedings, Las Vegas 2, 328-332.