Daniel F. Baldwin
Associate Professor
Education
- Ph.D., Massachusetts Institute of Technology, 1994
- S.M., Massachusetts Institute of Technology, 1990
- B.S., Arizona State University, 1988
Research Areas and Descriptors
Background
Dr. Baldwin began at Tech in 1995 as an Assistant Professor. Prior, he was a Member of the Technical Staff at Bell Laboratories.
Dr. Baldwin has a diverse research background, which provides a broad range of experience in manufacturing fundamentals and the engineering sciences. His early research was in assembly processes and assembly system design; he developed methodologies and software tools to aid in the design of assembly systems used to produce complex mechanical assemblies, such as automotive transmissions and engines. His research interests then expanded into the field of polymer processing, focusing on the system level design and development of new and innovative process technologies for the production of novel microcellular foam materials. Dr. Baldwin's research expanded during his tenure at Bell Laboratories to work in electronics manufacturing, assembly, and packaging.
Research
Dr. Baldwin's research focuses on four areas: Precision injection molding is an emerging technology for high-volume production of plastic components with precision surface features and patterns. This research aims to satisfy the industrial demands for molded parts having tolerances ranging from the micron to submicron level. Innovative molding processes are being developed that will enable scale-up of the technology to production levels.
The second focus is the low-cost manufacturing of next-generation electronic assemblies. Competitiveness in the global electronics industry demands that the next generation of electronic assemblies realize a ten-fold cost reduction over current practice, while increasing performance and functionality and decreasing size and weight. This research addresses these demands through the development of innovative materials and process technologies.
The third focus is on smart tooling for the assembly of thin flexible systems. Here, emerging electronic assemblies demand lower cost, lighter weight, miniaturized packages mounted on thin, flexible circuit boards or flex circuits. This research seeks to develop such smart tooling for high-speed surface mount and high-volume packaging processes. He is also developing microelectromechanical systems (MEMS) and MEMS carriers for low-cost manufacturing.
Dr. Baldwin's research is sponsored by Siemens, the Defense Advanced Research Projects Agency, the National Science Foundation, Motorola, Chrysler, Cookson Electronics, Alpha Metals, Northrop Grumman, Loctite, and Georgia Tech.
Distinctions
- Institute of Electrical and Electronic Engineers Manufacturing Technology Conference Best Paper Award, 2004
- National Electronics Manufacturing Initiative Outstanding Project Award, 2000
- National Science Foundation Packaging Research Center Outstanding Faculty of the Year Award, 2000
- Society of Manufacturing Engineers Milton C. Shaw Outstanding Young Manufacturing Engineer Award, 1999
- American Society of Mechanical Engineers (Electrical and Electronics Packaging Division) Young Engineer Award, 1998
Selected Patents
- Method for Providing a Low Temperature Curable Gallium Alloy for Multichip Modulel Substrates, U. S. Patent 6,554,923, with Swapan Bhattacharya, April 29, 2003
- Method for Providing Continuous Processing of Microcellular and Supermicrocellular Foamed Materials, U. S. Patent 6,051,174, April 18, 2000
Representative Publications
- D. F. Baldwin and L. Higgins. 2004. Chip Scale, Flip Chip and Advanced Chip Packaging Technologies. In Electronics Packaging and Interconnection Handbook, C. A. Harper (Ed.). McGraw-Hill, New York.
- S. J. Ok, C. Kim, and D. F. Baldwin. 2003. High Density, High Aspect Ratio Through-Wafer Electrical Interconnect Vias for MEMS Packaging. IEEE Transactions on Advanced Packaging 26(3), 302-309.
- D. P. Clement, R. C. Lasky, and D. F. Baldwin 2002. Alignment Techniques and Metrology. In Handbook of Fiber Optic for Data Communication, 2nd edition, C. DeCusatis, et al. (Eds.). Academic Press, New York.
- D. F. Baldwin. 2001. Low Cost, High Throughput Flip Chip Processing and Reliability. In Handbook of Area Array Packaging, K. Gilleo (ed.). McGraw-Hill, New York.
- Q. Tan, et al. (Eds.). 2000. MEMS Packaging: Challenges and Future. Micro-Electro-Mechanical Systems (MEMS) 2000, MEMS 2. ASME, New York.
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