The mission of our group is to provide new thermal metrology tools and modeling capabilities which will enable the design, understanding, and management of thermal phenomena in GaN power electronics and LEDs. In addition, our group strives to develop new packaging materials and device architectures to improve the thermal management and reliability of organic flexible electronics and nitride semiconductors. Devices engineered from these materials will enable energy efficient solid state light sources, flexible solar cells, and advanced communications and sensors technologies.
Our group is located in the Woodruff School of Mechanical Engineering and is part of the College of Engineering at the Georgia Institute of Technology. In 2007, U.S. News & World Report ranked Georgia Tech's College of Engineering graduate school #4 in the nation while the Woodruff School’s graduate program was ranked 7th overall.
Students working in the ASMRL are exposed to a multidisciplinary research environment through strategic partnerships and affiliations with other laboratories and research centers at Georgia Tech and around the world. This includes the NSF-STC Materials and Devices for Information Technology Research, COPE, Atlantic Alliance, as well as key collaborators in South Korea, Taiwan, and the United Kingdom. Students involved in this research typically have a background in Mechanical Engineering with an interest in Materials Science and Engineering, Electrical Engineering, Chemistry, and Solid State Physics.
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