We have Four Main Categories!!
If you want some more detail about each group, just press the first letter of group names!
PD Group By Contact Potential Difference(CPD) method, we are developing many applications.
MP Group Chemical Mechanical Polishing/Planarization or CMP in short is an integrated-circuit (IC) fabrication process for polishing semiconductor wafers. We have focused on the fundamental research of the tribological aspects of CMP.
CD Group Intermetallic compounds are of great importance as structural materials in gas turbine applications. The work at the EML intends to relate grinding parameters with the damage produced on TiAl and NiAl.
SMI Group The residual stresses inside the silicon may cause failure during processing or poor reliability in future service. Therefore, it is critical to measure the in-situ residual stresses in the silicon in order to find the best processing parameters to control the quality of products.
