Electronic Materials Laboratory (EML) was established in 1993 by Dr. Steven Danyluk, a Professor and Morris M. Bryan, Jr. Chair in Mechanical Engineering for Advanced Manufacturing Systems. Initially EML focused on wafering, lapping, grinding, dicing, and polishing of silicon and gallium arsenide, as well as the development of methods to measure the damage in these semiconductor materials when they are processed. Presently, EML includes 10 students (8 Ph.D. students among them), a post-doctoral fellows and a visiting scientist, who are concentrating on: 1) Non-contact integrated diagnostic sensor (CPD sub-group), 2) Chemical-mechanical polishing of silicon wafers for integrated circuit fabrication (CMP sub-group), 3) Investigation on residual stress and debris during hard cutting process (HCP sub-group), 4) Residual stress Moir?interferometry of silicon crystals (RSMI sub-group). It is currently funded by
the Office of Naval Research, the National Science
Foundation, Motorola, Chemical Products Incorporation
and EKC Technology Incorporation, etc.