Director

Suresh K. Sitaraman, Ph.D . 

Professor
George W. Woodruff School of Mechanical Engineering
813 Ferst Drive, MARC Building, Room 471
Georgia Institute of Technology
Atlanta, GA 30332-0405
email: suresh.sitaraman@me.gatech.edu

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Senior Research Engineer

Raghuram Pucha, Ph.D. (Indian Institute of Science)

Selected Publications

Past Post-Doctoral Fellows

Yeong Kim , Ph.D. (University of Illinois, Urbana-Champagne)
ChipSeal Studies
October 2002– 2003

Zhao Hui Shan , Ph.D. (Hong Kong University of Science and Technology)
Nanoindentation Studies and Material Characterization  
January 2001 – 2003

Vish Sundararaman, Ph.D. (Syracuse University)
MCM-D and VSPA Studies
April 1997 – March 1999
Currently employed at Texas Instruments

Hurang Hu, Ph.D. (Syracuse University)
NIST Microspring Studies
April 1999 – Sep. 2000
Currently employed as Asst. Professor at Clark Atlanta University

Visited Scholars and Students

John Pang, Ph.D.
Visiting Scholar from the School of Mechanical and Production Engineering
Nanyang Technological University, Singapore
Summer and Fall 1997

Rudolf Krondorfer
Visiting Ph.D. student from Norwegian University of Science and Technology
Fall 2001 and Spring 2002

 

 

 

Ph.D. Students

Jamie Ahmad

Multi-Component Board Assembly Reliability

gte592w@prism.gatech.edu
678-595-5496
 

 

Kevin Klein

Stress-Engineered Springs

gt6939a@prism.gatech.edu
 

 Xi Liu

Microstructural evolution of Lead-free Solder Under Thermal Cycling, Power Cycling, and Vibration Environments

xi.liu@gatech.edu
 

 

Nicholas Ginga

Interface Characterization for Advanced Micro-Systems Applications

nick.ginga@gatech.edu
 

Gregory Ostrowicki

Stress-Engineered Springs

gtostrowicki@gatech.edu
 

 

Graduated Ph.D. Students

Krishna Tunga

Thermo-mechanical modeling of BGA packages, laser moire interferometry and lead-free solder microstructure evolution

gtg958b@prism.gatech.edu
 

Jiantao Zheng

Process Dependent Interface Characterization for Advanced Micro-Systems Applications

gte536w@mail.gatech.edu

 

Karan Kacker

Lead-free solders and G-helix interconnects

gtg713p@mail.gatech.edu
 

 

Injoong Kim

Computer-aided electronic system design for reliability

injoong.kim@eislab.gatech.edu
 

 

Shashikant Hegde

Thermo-Mechanical Modeling and Reliability of High-Speed Optoelectronic Packaging

gte109x@prism.gatech.edu

Sakethraman Mahalingam

Reliability of Flipchip Package with Nano-filled Underfilled Material
 

Fall 2001 - 2005
Employed at General Electric*         ( * employer at the time of graduation)

 

Andrew Perkins

High And Low Cycle Fatigue Failure Of Solder Joints
SMTA Hutchins Grant, 2003
SMTA Atlanta Scholarship, 2002-2004
Georgia Tech ME Presidential Fellowship, 2000-2004
NSF Honorable Mention, 2001

Fall 2000 - 2007
Employed at Micron Technologies*

 

Mitul Modi

Interfacial Behavior for Micro-Contact Springs for High-Density Packaging
Presidential Fellowship, 1999-2003

Fall 1998 - 2003
Employed at Intel Corporation*

 

Angela Qi Zhu

Design, Fabrication and Thermo-mechanical Reliability of compliant interconnects for High I/O density Packaging
Sigma Xi Outstanding Ph.D. Thesis Award, Qi Zhu, 2003

Spring 1999 - 2003
Employed at Applied Materials Corporation*

 

Dennis Lunyu Ma

Design and Thermo-Mechanical Study of Micro-Contact Springs for Probing and High I/O Density Packaging

Fall 2000 - 2003 (co-advisor: Dr. R. Fulton)
Employed at Form Factor*

 

Stelios Michaelides

Physics-Based Process Modeling, Reliability Prediction and Design Guidelines for Flip-Chip Devices
Onassis Foundation Scholarship, 1997-1999
Leventis Foundation Scholarship, 1995-1997

Summer 1995 - Summer 1999

Rajiv Dunne

An Integrated process Modeling Methodology and Module for Sequential Multilayered High-Density Substrate Fabrication for Microelectronic Packages
Outstanding Poster Award (Graduate/ART) - Second Place - Thermo-Mechanical Modeling of SLIM - IAB/NSF Site Visit, Oct. 1997

Summer 1995 - Fall 2000
Currently employed at Texas Instrument

Weidong Xie

Thermo-Mechanical Evaluation of Interfacial Integrity in Multilayered Microelectronic Packages

Winter 1998 - Summer 2001
Employed in Agere Systems*

Masters Thesis Students

 

Raphael Okereke

 

ralphyralph@gatech.edu
 

 

Sathyanarayanan Raghavan

 

sathya@gatech.edu
 

 

Justin Chow

 

justin.chow@gatech.edu
 

 

Graduated Masters Thesis Students

 

Luke Mcclasin

Package Warpage Caculation
Spring 2006 - Summer 2008
-*

 

Manoj Damani

Physics-Based Reliability Assessment of Embedded Passives
Spring 2003 - Summer 2004
Employed at Qualcomm*

 

Kang Joon (KJ) Lee

Fabrication and Reliability of Embedded Passives
Fall 2002 - Fall 2005
Employed at Intel*

 

George Lo

Electroplated Compliant High-Density Interconnects for Next-Generation Microelectronic Packaging
Fall 2001 - Summer 2004
Employed at General Electric Corporation*

 

Francis Classe

Asymmetric Thermal Profiles: A Different Approach to Accelerated Qualification of Chip Scale Packages
Fall 2000 - 2003
Employed at Spansion*

 

Gnyaneshwar Ramakrishna

Physics-based Modeling Methodology for Reliability of Microvias
Fall 2000 - Summer 2002
Employed at Cisco Corporation*

 

James Pyland

Damage Metric Based-Thermal Cycling Guidelines For Area-Array Packages Used In Harsh Thermal Conditions
IMAPS Educational Foundation Scholarship
Spring 2000 - Spring 2002
Employed at Cameron Corporation*

 

Hernan Mercado-Corujo

Study of the Thermo-Mechanical Reliability of a Plated-Through-Hole / Press-Pin Assembly
Fall 1999 - Spring 2001
Employed at Eaton Corporation*

Mudasir Ahmad

Structural Thermal-Electric Modeling and Analysis of Micro-Springs for Microelectronic Probing and Packaging Applications
Fall 1999 - Summer 2001
Employed at Cisco Systems*

Rajiv Raghunathan

Virtual Qualification Methodology for Next-Generation Area-Array Devices
Fall 1998 - Summer 2000
Employed at Siebel Corporation*

Joe Haemer

Thermo-Mechanical Modeling and Design of Micro-springs for Microelectronic Probing and Packaging
IMAPS Educational Foundation Scholarship, 1999-2000
Fall 1998 - Summer 2000
Employed at Nanonexus, Inc.*

Manjula Surendran Variyam

Palletization and Design-of-Simulations for Large Area Processing and Assembly in Electronic Packaging
Summer 1997 - Summer 1999
Employed at Texas Instruments*

 

Carlton Hanna

Study of Thermo-Mechanical Reliability of Area-Array Packages
Fall 1997 - Spring 1999
Employed at Intel Corp.*

 

Richard Harries

Process Modeling and Interfacial Delamination in a Peripheral Array Package
Fall 1996 - Spring 1998
Employed at Failure Analysis Associates*

Jill Conley

Hygro-Thermo Mechanical Behavior of Fiber-Optic Apparatus
Fall 1996 - Spring 1998
Employed at DuPont *

 

Kyle Smith

Thermo-Mechanical Behavior and Reliability of High-Density Interconnect (HDI) Vias
Fall 1995 - Summer 1997
Employed at Boeing*

 

Sean Murphy

Thermo-Mechanical Reliability of the VSPA Package Solder Joints
NSF Honorable Mention
Fall 1999 - Summer 1997
Employed at Hewlett-Packard*

Jorg Sizemore

Elastic-Plastic Modeling of PTH under Solder Shock Test
Winter 1995 - Spring 1996
Employed at Pratt-Whitney*

Non-Thesis Masters Students

Séké Godo

Thermo-Mechanical Reliability of Flip-Chip Packages in Harsh Environments

Seke.Godo@gatech.edu
 

 

Thomas Sokol

G-helix interconnects

gte249j@mail.gatech.edu
 

 

 

Marc Griswold

Thermo-mechanical Parametric Modeling and Reliability Studies for Lead Free Flip Chip Packages
Fall 2005 - 2006
Employed at Elan Motosport Technologies*

 

 

Uramela Suljozovik

Fall 2001 - 2003
Employed at Intel Corporation*

 

 

BSME Research Topics Students

Sidharth Shah
Failure analysis of plastic ball grid array package’
ME 4901, Special Problems
Fall 2007

Kevin Klein
Thermo-Mechanical Reliability of Microelectronic Packages and Probes’
ME 4901, Special Problems
Spring 2000

Raphael de Cardenas
Thermo-Mechanical Modeling of Quad-Flat Packs’
ME 4901 Special Problems
Summer 1997

Caliph Johnson
Thermo-Mechanical Behavior of Vias’
ME 4901 Special Problems
Winter 1997

Brian O’Hara
Thermo-Mechanical Behavior of Flip-Chip Assembly’
ME 4901 Special Problems
Winter 1997

Jill Conley
Elastic-Plastic Modeling of Plated-Through Holes in Solder Shock Test’
ME 4901 Special Problems
Sigma Xi Award for Outstanding Undergraduate Research
Winter 1996,

Marcial Machado
Virtual Reality and its Applications in the Design and Manufacturing Process’
ME4901 Special Problems
Spring 1995

Undergraduate Research Assistants

KJ Lee
Thermo-Mechanical Reliability of Plated-Through-Hole/Press-Pin Assemby
Spring 2001

Andrew Perkins
Thermo-Mechanical Modeling and Experiments for Microelectronic Packaging Reliability’
Spring 2000

Meera Srinivasan
CASPaR Development’
Summer 1998

Jason Tsai
Thermo-Mechanical Analysis of Flip-Chips with Solder Voids’
Fall 1997

Mark Lawson
CASPaR Development’
Fall 1997

Caliph Johnson
Process Modeling and Thermal Cycling of Vias
Outstanding Poster Award (Undergraduate) - First Place - Thermo-Mechanical Reliability of Vias - C. Johnson - IAB/NSF Site Visit, Oct. 1997
Spring-Fall 1997

Anthony Belvin, GT SUPREEM Scholar
A Comparison of Substrate Materials in Printed Wiring Boards’
Summer 1996

Student and Staff Resumes

Manoj Damani, MSME 2004
manoj_damani@hotmail.com
Reliability of Embedded Passives