CALL FOR PAPERS

Processes, Properties and Interfaces

March 15 -17, 2006
Georgia Tech Hotel and Conference Center
800 Spring Street NW
Atlanta, GA 30308

Abstract Deadline: January 31, 2006
Please Submit PDF Abstracts To cecelia.jones@me.gatech.edu
Click here for template examples on submitting your manuscript: Format 1 and Format 2

The 2006 International Symposium and Exhibition on Advanced Packaging Materials will be held at the Georgia Tech Hotel and Conference Center, Atlanta, GA, March 15 – 17, 2006. The symposium is sponsored by the IEEE Packaging and Manufacturing Technology (CPMT) Society.

The symposium is devoted to the advances made in electronic packaging materials. Topics of presentations will include, but not limited to, lead-free, Cu low-k, 3D packaging, adhesion, underfills, encapsulants and coatings, bumping and solders, substrates including HDI, high thermal and dielectrics, reliability, nano functional and passive materials.

Attendees of this symposium in the past have been comprised of researchers, developers, producers and users of materials for single and multichip packages, interconnections, substrates, microwaves applications, optoelectronic packages and display panels.

Keynote Speakers

Dr. Masuo Mizuno
Cheif R&D Officer
Sumitomo Bakelite Co., LTD., Japan

Professor Herb Reichl
Director of Fraunhofer IZM and Head of the Research Center for Microperipheric Technologies-System Integration, Technical University of Berlin, Germany.

Dr. Ho-Ming Tong
Corporate Vice President and General Manager of Corporate R&D, ASE Group, Taiwan.

Professor Rao Tummala
Pettit Chair Professor in Microsystems Packaging and Director NSF-ERC in SOP Technology, Georgia Institute of Technology, USA.

Free Workshop
A half-day workshop on Packaging Materials and Reliability will be given by Professors' C.P. Wong and Jianmin Qu. The workshop is free to registered attendees.

Conference Proceedings
A Conference Proceeding will be published. To be included in the proceeding, a full paper (4-6 pages) must be received by January 31, 2006

For More Information, Please Contact:

Professor Jianmin Qu
School of Mechanical Engineering, Georgia Tech, Atlanta, GA 30332-0405, Phone: 404-894-5687, E-Mail: jianmin.qu@me.gatech.edu.

Professor C.P. Wong
School of Materials Science and Engineering, Georgia Tech., Atlanta, GA 30332-0405, Phone: 404-894-8391, E-Mail: cp.wong@mse.gatech.edu.